JPS5711718A - Diamond die - Google Patents

Diamond die

Info

Publication number
JPS5711718A
JPS5711718A JP8594580A JP8594580A JPS5711718A JP S5711718 A JPS5711718 A JP S5711718A JP 8594580 A JP8594580 A JP 8594580A JP 8594580 A JP8594580 A JP 8594580A JP S5711718 A JPS5711718 A JP S5711718A
Authority
JP
Japan
Prior art keywords
hole
plane
diamond
bored
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8594580A
Other languages
Japanese (ja)
Inventor
Yoshigoro Ogura
Nobuo Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OGURA HOUSEKI SEIKI KOGYO KK
OGURA JEWEL INDUSTRY CO Ltd
Original Assignee
OGURA HOUSEKI SEIKI KOGYO KK
OGURA JEWEL INDUSTRY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OGURA HOUSEKI SEIKI KOGYO KK, OGURA JEWEL INDUSTRY CO Ltd filed Critical OGURA HOUSEKI SEIKI KOGYO KK
Priority to JP8594580A priority Critical patent/JPS5711718A/en
Publication of JPS5711718A publication Critical patent/JPS5711718A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a diamond die of a long service life to be free from a partial abrasion, by arranging the direction of a through hole to be bored in a wire drawing diamond die in the direction 100 or 110, and by forming both end planes of this diamnd die into a plane 100 or 110.
CONSTITUTION: A through hole 3 is bored in a diamond octahedron 1 from its one apex 2 to opposite apex 2' by a laser drill, and the hole 3 is then widened into a prescribed shape by a diamond tool, etc. The direction of this through hole 3 becomes hereby the direction 100 and both end planes becomes the plane 100. Meanwhile, if a through hole 3 is bored from an approximate center of a ridge 6 of a diamond octahedron to opposite parallel ridge 6', the direction of the hole 3 becomes the direction 110 and both end planes become a plane 110. Thus arranged direction and plane do not cause a partial abrasion; especially, the direction 110 and the end plane 110 display a high abrasion-resistance.
COPYRIGHT: (C)1982,JPO&Japio
JP8594580A 1980-06-26 1980-06-26 Diamond die Pending JPS5711718A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8594580A JPS5711718A (en) 1980-06-26 1980-06-26 Diamond die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8594580A JPS5711718A (en) 1980-06-26 1980-06-26 Diamond die

Publications (1)

Publication Number Publication Date
JPS5711718A true JPS5711718A (en) 1982-01-21

Family

ID=13872893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8594580A Pending JPS5711718A (en) 1980-06-26 1980-06-26 Diamond die

Country Status (1)

Country Link
JP (1) JPS5711718A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229227A (en) * 1983-06-08 1984-12-22 Sumitomo Electric Ind Ltd Die using single crystal of synthetic diamond
EP0655285A1 (en) * 1993-11-05 1995-05-31 General Electric Company Optically improved diamond wire-drawing-die

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229227A (en) * 1983-06-08 1984-12-22 Sumitomo Electric Ind Ltd Die using single crystal of synthetic diamond
EP0655285A1 (en) * 1993-11-05 1995-05-31 General Electric Company Optically improved diamond wire-drawing-die
US5465603A (en) * 1993-11-05 1995-11-14 General Electric Company Optically improved diamond wire die

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