JPS6455387A - Electroless plating method - Google Patents

Electroless plating method

Info

Publication number
JPS6455387A
JPS6455387A JP21200787A JP21200787A JPS6455387A JP S6455387 A JPS6455387 A JP S6455387A JP 21200787 A JP21200787 A JP 21200787A JP 21200787 A JP21200787 A JP 21200787A JP S6455387 A JPS6455387 A JP S6455387A
Authority
JP
Japan
Prior art keywords
plated
compd
compds
allowing
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21200787A
Other languages
Japanese (ja)
Inventor
Hiroshi Hasegawa
Munehiro Tabata
Kazuyuki Okano
Yasuto Isozaki
Chiharu Niki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21200787A priority Critical patent/JPS6455387A/en
Publication of JPS6455387A publication Critical patent/JPS6455387A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To uniformly activate the whole surface of a face to be plated and to enable electroless plating of a uniform thin layer by allowing a material to be plated to be laminated with pyrolytic silver compd. or palladium compd. and thereafter decomposing these compds. with heat or gaseous plasma. CONSTITUTION:A material to be plated is laminated with pyrolytic silver compd. or palladium compd. As these compds., inorganic or organic salt and halide of these metals, organic compd. and metallic complex contg. the above- mentioned metals in the structure which are decomposed at the temp. lower than such temp. that the material to be plated is not affected are used. Further, this laminating can be performed by dissolving or dispersing these compds. into a solvent and allowing the surface of the material to be applied with this soln. Then the compds. of the laminated face are decomposed with heat or gaseous plasma. Thereby the whole surface of the face to be plated in uniformly activated by allowing only metallic superfine particles to remain on the surface of the material to be plated. A uniform plated film having about 1,000Angstrom or below can be formed by subjecting the material to be plated after the above- mentioned activating treatment to electroless plating.
JP21200787A 1987-08-26 1987-08-26 Electroless plating method Pending JPS6455387A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21200787A JPS6455387A (en) 1987-08-26 1987-08-26 Electroless plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21200787A JPS6455387A (en) 1987-08-26 1987-08-26 Electroless plating method

Publications (1)

Publication Number Publication Date
JPS6455387A true JPS6455387A (en) 1989-03-02

Family

ID=16615340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21200787A Pending JPS6455387A (en) 1987-08-26 1987-08-26 Electroless plating method

Country Status (1)

Country Link
JP (1) JPS6455387A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012036231A1 (en) * 2010-09-15 2012-03-22 国際先端技術総合研究所株式会社 Glass with photocatalytic function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012036231A1 (en) * 2010-09-15 2012-03-22 国際先端技術総合研究所株式会社 Glass with photocatalytic function
CN103167908A (en) * 2010-09-15 2013-06-19 国际先端技术总合研究所株式会社 Glass with photocatalytic function

Similar Documents

Publication Publication Date Title
DE3874867T2 (en) METHOD FOR TREATING A COPPER SURFACE.
DE3375027D1 (en) Method of producing a hard layer on articles of ti or ti-alloys
ES8205269A1 (en) Method of activating surfaces for electroless plating.
DE3378262D1 (en) Process of in-line coating and decorative layer lamination with panel board material and the like employing electron-beam irradiation, and decorated panel produced thereby
JPS6455387A (en) Electroless plating method
JPS6462475A (en) Composite material and its production and method for precipitating metal
EP0272420A3 (en) Photopatterned aromatic polymeric substrates, method for making same and use
JPS5462930A (en) Chemical plating pretreatment method
JPS53141369A (en) Treatment of article with thermosetting resin
DE2239908A1 (en) Substrate for printed circuits with sealed surface - esp modified epoxy resin layer treated with alkaline permanganate soln, avoiding inactivation on storage
JPS6480523A (en) Polyolefin coated aluminum alloy laminate
JPS5534660A (en) Manufacture of decorative metal plate
JPS57114653A (en) Indium plating method
Rudnev The Radiation-Stimulated Annealing of Voids in Nickel by Low-Temperature Irradiation With Nickel Ions
Bodyako et al. The Effect of a Copper Coating on the Siliconizing of Titanium Alloys
DE1521210C3 (en) Pre-treatment of plastics for electroless metallization
Sorensen et al. Method of Producing an Alloy or a Mixture of Elements in the Surface of a Substrate
JPS6412563A (en) Nickel plating of lead frame
GB2110247A (en) Method of producing an alloy or a mixture of elements in the surface of a substrate
JPS57155358A (en) Metalizing treatment process
JPS6454718A (en) Manufacture of magnetic film
Kakes et al. How to carburize a finished gear
JPS6411980A (en) Electroless solder plating method
Rimsa Treatment of Drilled Copper-Clad Thermoplastic Laminates
KOONTZ Microporous structure with layered interstitial surface treatment, and method and apparatus for preparation thereof(Patent Application)