JPS6452910A - Injection tube device and ground grouting work using same - Google Patents

Injection tube device and ground grouting work using same

Info

Publication number
JPS6452910A
JPS6452910A JP20766487A JP20766487A JPS6452910A JP S6452910 A JPS6452910 A JP S6452910A JP 20766487 A JP20766487 A JP 20766487A JP 20766487 A JP20766487 A JP 20766487A JP S6452910 A JPS6452910 A JP S6452910A
Authority
JP
Japan
Prior art keywords
tube
ground
packer
grout
tubes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20766487A
Other languages
Japanese (ja)
Other versions
JP2772637B2 (en
Inventor
Kenji Kashiwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyokado Engineering Co Ltd
Original Assignee
Kyokado Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyokado Engineering Co Ltd filed Critical Kyokado Engineering Co Ltd
Priority to JP62207664A priority Critical patent/JP2772637B2/en
Publication of JPS6452910A publication Critical patent/JPS6452910A/en
Application granted granted Critical
Publication of JP2772637B2 publication Critical patent/JP2772637B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Consolidation Of Soil By Introduction Of Solidifying Substances Into Soil (AREA)

Abstract

PURPOSE:To concurrently solidify the ground consisting of different water- permeable layers by a method in which a packer is set in the aperture of the inner and outer tubes of a double tube having openings in its inner and outer tubes, and grout is injected into the ground by using the packer. CONSTITUTION:An outer tube 21 in which the outlet 25 of the tube wall 24 is covered with a rubber sleeve 26 is set in a pit formed in a ground 23. An inner tube 22 having a jet nozzle 28 in its tube wall 27 on the axially different position from the outlet 25 is inserted into the outer tube 21, and a packer 30 is set between the tubes 22 and 21 to form many spaces 31 surrounded by the tubes 22 and 21 and the packer 30. Grout is introduced into the tube 22 and injected from the nozzle 28 into the spaces 31. The grout expands the rubber sleeve 26 through the outlet 25, breaks a sleeve grout 32 injected between the tube 21 and the ground 23, and permeates into the ground 23.
JP62207664A 1987-08-21 1987-08-21 Injection pipe device and ground injection method using this device Expired - Fee Related JP2772637B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62207664A JP2772637B2 (en) 1987-08-21 1987-08-21 Injection pipe device and ground injection method using this device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62207664A JP2772637B2 (en) 1987-08-21 1987-08-21 Injection pipe device and ground injection method using this device

Publications (2)

Publication Number Publication Date
JPS6452910A true JPS6452910A (en) 1989-03-01
JP2772637B2 JP2772637B2 (en) 1998-07-02

Family

ID=16543511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62207664A Expired - Fee Related JP2772637B2 (en) 1987-08-21 1987-08-21 Injection pipe device and ground injection method using this device

Country Status (1)

Country Link
JP (1) JP2772637B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100397250B1 (en) * 1999-03-09 2003-09-13 쿄오까도엔지니어링가부시기가이샤 The device and the method for pouring ground
US6830949B2 (en) 2000-04-21 2004-12-14 Toyoda Gosei Co., Ltd. Method for producing group-III nitride compound semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4848553B2 (en) * 2009-12-22 2011-12-28 強化土株式会社 Injection pipe device and injection method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517900U (en) * 1979-08-16 1980-02-04
JPS5633346U (en) * 1979-08-22 1981-04-01
JPS61186613A (en) * 1985-02-15 1986-08-20 Raito Kogyo Kk Grout pouring device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517900U (en) * 1979-08-16 1980-02-04
JPS5633346U (en) * 1979-08-22 1981-04-01
JPS61186613A (en) * 1985-02-15 1986-08-20 Raito Kogyo Kk Grout pouring device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100397250B1 (en) * 1999-03-09 2003-09-13 쿄오까도엔지니어링가부시기가이샤 The device and the method for pouring ground
US6830949B2 (en) 2000-04-21 2004-12-14 Toyoda Gosei Co., Ltd. Method for producing group-III nitride compound semiconductor device

Also Published As

Publication number Publication date
JP2772637B2 (en) 1998-07-02

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