JPS6452718U - - Google Patents
Info
- Publication number
- JPS6452718U JPS6452718U JP14789187U JP14789187U JPS6452718U JP S6452718 U JPS6452718 U JP S6452718U JP 14789187 U JP14789187 U JP 14789187U JP 14789187 U JP14789187 U JP 14789187U JP S6452718 U JPS6452718 U JP S6452718U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- cavity
- mold
- circuit pattern
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14789187U JPH043772Y2 (cs) | 1987-09-28 | 1987-09-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14789187U JPH043772Y2 (cs) | 1987-09-28 | 1987-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6452718U true JPS6452718U (cs) | 1989-03-31 |
JPH043772Y2 JPH043772Y2 (cs) | 1992-02-05 |
Family
ID=31418716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14789187U Expired JPH043772Y2 (cs) | 1987-09-28 | 1987-09-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH043772Y2 (cs) |
-
1987
- 1987-09-28 JP JP14789187U patent/JPH043772Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH043772Y2 (cs) | 1992-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6452718U (cs) | ||
JP2516650B2 (ja) | モ―ルド回路基板の製造方法 | |
JPH01121966U (cs) | ||
JPH0452017U (cs) | ||
JPH0278320U (cs) | ||
JPS60178113U (ja) | 転写成形装置の金型 | |
JPS6418779U (cs) | ||
JPS6024519U (ja) | 射出成形用金型 | |
JPH0372416U (cs) | ||
JPH0450211U (cs) | ||
JPH0288466U (cs) | ||
JPS612914U (ja) | 射出成形金型構造 | |
JPS583035U (ja) | 樹脂モ−ルド用の型 | |
JPS59160217U (ja) | プラスチック成形金型 | |
JPS60123217U (ja) | 射出成形用金型 | |
JPH01116617U (cs) | ||
JPH0436279U (cs) | ||
JPS6420770U (cs) | ||
JPS6096016U (ja) | 一体成形用金型 | |
JPS63132379U (cs) | ||
JPS60117116U (ja) | 射出成形金型 | |
JPH0348257U (cs) | ||
JPS6217142U (cs) | ||
JPS62111827U (cs) | ||
JPH0422214U (cs) |