JPS6451373U - - Google Patents
Info
- Publication number
- JPS6451373U JPS6451373U JP1987145523U JP14552387U JPS6451373U JP S6451373 U JPS6451373 U JP S6451373U JP 1987145523 U JP1987145523 U JP 1987145523U JP 14552387 U JP14552387 U JP 14552387U JP S6451373 U JPS6451373 U JP S6451373U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- image sensor
- state image
- imaging device
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案固体撮像装置の一つの実施例を
示す断面図、第２図Ａ，Ｂは第１図に示した固体
撮像装置の製法を工程順に示す断面図、第３図は
本考案固体撮像装置の他の実施例を示す断面図、
第４図Ａ，Ｂは第３図に示した固体撮像装置の製
法を工程順に示す断面図、第５図は考案が解決し
ようとする問題点であるアオリの説明図である。
符号の説明、１，１ａ……パツケージ、３，３
ａ……固体撮像素子ボンデイング面、５……固体
撮像素子、８……光学基準面、９，９ａ……ホツ
トプレス型。
FIG. 1 is a sectional view showing one embodiment of the solid-state imaging device of the present invention, FIGS. 2A and B are sectional views showing the manufacturing method of the solid-state imaging device shown in FIG. A cross-sectional view showing another example of a solid-state imaging device,
4A and 4B are cross-sectional views showing the manufacturing method of the solid-state imaging device shown in FIG. 3 in the order of steps, and FIG. 5 is an explanatory view of tilting, which is the problem that the invention aims to solve. Explanation of symbols, 1, 1a...Package, 3, 3
a... Solid-state image sensor bonding surface, 5... Solid-state image sensor, 8... Optical reference surface, 9, 9a... Hot press type.
Claims (1)
ツクからなり、 上記パツケージの固体撮像素子がボンデイング
された面と、光学基準面とが固体撮像素子ボンデ
イング前のホツトプレスの際に一つのホツトプレ
ス型によつて規定された面である、 ことを特徴とする固体撮像装置。[Scope of Claim for Utility Model Registration] A package containing a solid-state image sensor is made of plastic, and the surface of the package on which the solid-state image sensor is bonded and the optical reference surface are formed into one body during hot pressing before bonding the solid-state image sensor. A solid-state imaging device characterized in that the surface is defined by a hot press mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145523U JPS6451373U (en) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987145523U JPS6451373U (en) | 1987-09-24 | 1987-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6451373U true JPS6451373U (en) | 1989-03-30 |
Family
ID=31414188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987145523U Pending JPS6451373U (en) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6451373U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546046U (en) * | 1991-11-21 | 1993-06-18 | ソニー株式会社 | Solid-state imaging device |
-
1987
- 1987-09-24 JP JP1987145523U patent/JPS6451373U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546046U (en) * | 1991-11-21 | 1993-06-18 | ソニー株式会社 | Solid-state imaging device |