JPS645098A - Ceramic multilayer interconnection substrate - Google Patents

Ceramic multilayer interconnection substrate

Info

Publication number
JPS645098A
JPS645098A JP16167887A JP16167887A JPS645098A JP S645098 A JPS645098 A JP S645098A JP 16167887 A JP16167887 A JP 16167887A JP 16167887 A JP16167887 A JP 16167887A JP S645098 A JPS645098 A JP S645098A
Authority
JP
Japan
Prior art keywords
tungsten
molybdenum
hole
alumina
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16167887A
Other languages
Japanese (ja)
Inventor
Yoshiya Kudou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16167887A priority Critical patent/JPS645098A/en
Publication of JPS645098A publication Critical patent/JPS645098A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To prevent a ceramic member from cracking, to reduce resistance of a conductor, and to increase a wiring density, by employing alumina, molybdenum, and tungsten for respective materials if an insulating layer, a conductive layer filling a through hole, and a wiring layer. CONSTITUTION:Insulating layers 1, 5 are made of alumina. A conductive layer 3 which fills a through hole 2 is made of molybdenum. And a wiring layer 4 is made of tungsten. Then, the through hole 2 is so filled with a conductive layer 3 of molybdenum whose thermal expansion coefficient is closer to that of alumina rather than that of tungsten that cracks are difficult to be generated in the part A. Accordingly, generation of warpage resulting from mismatch of the coefficient of contraction between the green sheet and the wiring layer 4 is reduced effectively. Therefore, the resistance of a conductor is reduced, and the wiring density is increased.
JP16167887A 1987-06-29 1987-06-29 Ceramic multilayer interconnection substrate Pending JPS645098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16167887A JPS645098A (en) 1987-06-29 1987-06-29 Ceramic multilayer interconnection substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16167887A JPS645098A (en) 1987-06-29 1987-06-29 Ceramic multilayer interconnection substrate

Publications (1)

Publication Number Publication Date
JPS645098A true JPS645098A (en) 1989-01-10

Family

ID=15739761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16167887A Pending JPS645098A (en) 1987-06-29 1987-06-29 Ceramic multilayer interconnection substrate

Country Status (1)

Country Link
JP (1) JPS645098A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093186A (en) * 1989-09-26 1992-03-03 Ngk Spark Plug Co., Ltd. Multilayer ceramic wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5093186A (en) * 1989-09-26 1992-03-03 Ngk Spark Plug Co., Ltd. Multilayer ceramic wiring board

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