JPS6450439U - - Google Patents
Info
- Publication number
- JPS6450439U JPS6450439U JP14506587U JP14506587U JPS6450439U JP S6450439 U JPS6450439 U JP S6450439U JP 14506587 U JP14506587 U JP 14506587U JP 14506587 U JP14506587 U JP 14506587U JP S6450439 U JPS6450439 U JP S6450439U
- Authority
- JP
- Japan
- Prior art keywords
- slope
- power semiconductor
- heat conduction
- disposed
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の原理図、第２図は本考案の実
施例を示す正面図、第３図は第２図における側面
図、第４図は従来の技術の一例を示す正面図、第
５図は第４図における側面図、第６図は従来の技
術の他の一例を示す正面図、第７図は第６図にお
ける側面図である。
第１図乃至第３図において、１１，２２は冷却
部、１２，２３は熱伝導部、１２ａ，２３ｂは第
１の斜面、１２ｂ，２３ｃは第２の斜面、１３，
２５は電力用半導体（ＦＥＴ）である。
Fig. 1 is a diagram of the principle of the present invention, Fig. 2 is a front view showing an embodiment of the invention, Fig. 3 is a side view of Fig. 2, and Fig. 4 is a front view showing an example of the conventional technology. 5 is a side view of FIG. 4, FIG. 6 is a front view showing another example of the prior art, and FIG. 7 is a side view of FIG. 6. 1 to 3, 11 and 22 are cooling parts, 12 and 23 are heat conduction parts, 12a and 23b are first slopes, 12b and 23c are second slopes, 13,
25 is a power semiconductor (FET).
Claims (1)
配設される熱伝導部１２とからなり、前記電力用
半導体１３より発生する熱を前記熱伝導部１２を
介して前記冷却部１１に伝達し、冷却する放熱器
において、 前記熱伝導部１２に第１の斜面１２ａと該第１
の斜面１２ａに対して鋭角をなす第２の斜面１２
ｂとを設け、 これら斜面１２ａ，１２ｂに前記電力用半導体
１３を配設したことを特徴とする放熱器。[Claims for Utility Model Registration] Consisting of a cooling section 11 cooled by a refrigerant, and a heat conduction section 12 connected to the cooling section 11 and disposed with a power semiconductor 13, the power semiconductor 13, the heat radiator transmits and cools the heat generated from the heat conduction part 12 to the cooling part 11, the heat conduction part 12 includes a first slope 12a and the first slope 12a.
A second slope 12 forming an acute angle with respect to the slope 12a of
b, and the power semiconductor 13 is disposed on these slopes 12a and 12b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14506587U JPS6450439U (en) | 1987-09-22 | 1987-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14506587U JPS6450439U (en) | 1987-09-22 | 1987-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450439U true JPS6450439U (en) | 1989-03-29 |
Family
ID=31413329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14506587U Pending JPS6450439U (en) | 1987-09-22 | 1987-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450439U (en) |
-
1987
- 1987-09-22 JP JP14506587U patent/JPS6450439U/ja active Pending
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