JPS6450419A - Manufacture of complementary mos semiconductor device - Google Patents

Manufacture of complementary mos semiconductor device

Info

Publication number
JPS6450419A
JPS6450419A JP62207456A JP20745687A JPS6450419A JP S6450419 A JPS6450419 A JP S6450419A JP 62207456 A JP62207456 A JP 62207456A JP 20745687 A JP20745687 A JP 20745687A JP S6450419 A JPS6450419 A JP S6450419A
Authority
JP
Japan
Prior art keywords
thin
conductive film
impurity
region
drain regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62207456A
Other languages
Japanese (ja)
Inventor
Nobuaki Hotta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62207456A priority Critical patent/JPS6450419A/en
Publication of JPS6450419A publication Critical patent/JPS6450419A/en
Pending legal-status Critical Current

Links

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent dielectric breakdown of a thin gate insulating film and to improve the yield rate of devices, by forming a thick conductive film in a region where ion implantation is masked, forming a thin conductive film at a part where source and drain regions are formed, connecting both conductive films, and implanting impurity ions. CONSTITUTION:A polycrystalline silicon gate electrode 105 is formed on a thin gate insulating film 106. Thereafter, the region of impurity diffused layers for the source and drain regions of a P channel and an N channel are formed by an impurity ion implanting method. At this time, a thick field oxide film 103 is formed in a region, where ion implantation is masked. A thin gate insulating film 104 is formed at a part, where the source and drain regions are formed by impurity ion implantation. Under the state the thick conductive film 103 and the thin conductive film 104 are connected, respective impurity ions are implanted. Thus, the dielectric breakdown of the gate oxide film due to charge-up is eliminated, and the yield rate of the devices is improved.
JP62207456A 1987-08-20 1987-08-20 Manufacture of complementary mos semiconductor device Pending JPS6450419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62207456A JPS6450419A (en) 1987-08-20 1987-08-20 Manufacture of complementary mos semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62207456A JPS6450419A (en) 1987-08-20 1987-08-20 Manufacture of complementary mos semiconductor device

Publications (1)

Publication Number Publication Date
JPS6450419A true JPS6450419A (en) 1989-02-27

Family

ID=16540072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62207456A Pending JPS6450419A (en) 1987-08-20 1987-08-20 Manufacture of complementary mos semiconductor device

Country Status (1)

Country Link
JP (1) JPS6450419A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340419A (en) * 2004-05-26 2005-12-08 Kokusan Denki Co Ltd Ignition coil for internal combustion engine and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340419A (en) * 2004-05-26 2005-12-08 Kokusan Denki Co Ltd Ignition coil for internal combustion engine and method for manufacturing the same

Similar Documents

Publication Publication Date Title
CA1151295A (en) Dual resistivity mos devices and method of fabrication
US5406110A (en) Resurf lateral double diffused insulated gate field effect transistor
US3653978A (en) Method of making semiconductor devices
US4422885A (en) Polysilicon-doped-first CMOS process
TW332924B (en) Semiconductor
US5625216A (en) MOS transistor having increased gate-drain capacitance
JPS6446981A (en) Semiconductor device
US5047356A (en) High speed silicon-on-insulator device and process of fabricating same
US4474624A (en) Process for forming self-aligned complementary source/drain regions for MOS transistors
US4229756A (en) Ultra high speed complementary MOS device
US5672530A (en) Method of making MOS transistor with controlled shallow source/drain junction
US4294002A (en) Making a short-channel FET
US5482888A (en) Method of manufacturing a low resistance, high breakdown voltage, power MOSFET
US4713329A (en) Well mask for CMOS process
JPH0244154B2 (en)
US5218214A (en) Field oxide termination and gate oxide
JPS5333074A (en) Production of complementary type insulated gate field effect semiconductor device
JPS6450419A (en) Manufacture of complementary mos semiconductor device
JPS57107067A (en) Manufacture of semiconductor device
JPS56107552A (en) Manufacture of semiconductor device
KR950021134A (en) Contact formation method of semiconductor device
JPS55121680A (en) Manufacture of semiconductor device
JPH0644605B2 (en) Method of manufacturing high breakdown voltage MOS field effect semiconductor device
KR910009743B1 (en) High speed and high voltage semiconductor device and its manufacturing method
JPS57104259A (en) Metal oxide semiconductor device