JPS645029A - Appearance inspection equipment - Google Patents

Appearance inspection equipment

Info

Publication number
JPS645029A
JPS645029A JP16179587A JP16179587A JPS645029A JP S645029 A JPS645029 A JP S645029A JP 16179587 A JP16179587 A JP 16179587A JP 16179587 A JP16179587 A JP 16179587A JP S645029 A JPS645029 A JP S645029A
Authority
JP
Japan
Prior art keywords
image
inspected
lead
lead pins
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16179587A
Other languages
Japanese (ja)
Inventor
Nobuyo Kimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP16179587A priority Critical patent/JPS645029A/en
Publication of JPS645029A publication Critical patent/JPS645029A/en
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To recognize the shape of an object to be inspected, such as the up ward bend and the downward bend of a lead pin, by taking the image of the object to be inspected with a camera, and detecting the length of the shadow of the object to be inspected from a image projection plate. CONSTITUTION:Lead pins 11 are irradiated with a light source 3 of direct light, and the shadows are guided to a CCD camera 2 by adjusting an image projec tion plate 6 capable of rocking. The camera 2 detects the images of the upper surface of the lead pins 11 of a semiconductor device 1 and the shadows of the lead pins 11. Based on the detected images, the pitch, the width and the number of the lead pins are recognized. The shadow of a lead pin 10 in the failure state of upward bend is represented by an image 10a. As the area of its projection image is large, it is compared with the image of the lead pin 11 in normal state by the binary level image processing and can be recognized.
JP16179587A 1987-06-29 1987-06-29 Appearance inspection equipment Pending JPS645029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16179587A JPS645029A (en) 1987-06-29 1987-06-29 Appearance inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16179587A JPS645029A (en) 1987-06-29 1987-06-29 Appearance inspection equipment

Publications (1)

Publication Number Publication Date
JPS645029A true JPS645029A (en) 1989-01-10

Family

ID=15742055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16179587A Pending JPS645029A (en) 1987-06-29 1987-06-29 Appearance inspection equipment

Country Status (1)

Country Link
JP (1) JPS645029A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0257905A (en) * 1988-08-12 1990-02-27 Nec Kyushu Ltd Detector of degree of evenness of j-lead ic package
JPH0548347U (en) * 1991-11-28 1993-06-25 株式会社アドバンテスト IC imaging stage

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0257905A (en) * 1988-08-12 1990-02-27 Nec Kyushu Ltd Detector of degree of evenness of j-lead ic package
JPH0548347U (en) * 1991-11-28 1993-06-25 株式会社アドバンテスト IC imaging stage

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