JPS6448728A - Lead frame supplier of semiconductor mounting device - Google Patents

Lead frame supplier of semiconductor mounting device

Info

Publication number
JPS6448728A
JPS6448728A JP62202488A JP20248887A JPS6448728A JP S6448728 A JPS6448728 A JP S6448728A JP 62202488 A JP62202488 A JP 62202488A JP 20248887 A JP20248887 A JP 20248887A JP S6448728 A JPS6448728 A JP S6448728A
Authority
JP
Japan
Prior art keywords
lead frames
accommodator
clamper
lead frame
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62202488A
Other languages
Japanese (ja)
Other versions
JPH0694311B2 (en
Inventor
Hideaki Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62202488A priority Critical patent/JPH0694311B2/en
Publication of JPS6448728A publication Critical patent/JPS6448728A/en
Publication of JPH0694311B2 publication Critical patent/JPH0694311B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Sheets, Magazines, And Separation Thereof (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To provide stable operation by clamping the undermost one of the stacked lead frames in an accommodator with a set of clampers, separating downward forcedly, and thereby eliminating risk of taking-out of two or more pieces. CONSTITUTION:Lead frames 1 are stacked on accommodating guides 6a, 6b of an accommodator 6 and borne by a receipt pawl 2 situated below and a tapered part. Lead frames 1 in a plural number are pressed by a frame holder 4 so that no load is applied to the receipt pawl 2. Clampers 7a, 7b are provided below the accommodator 6, and rise of a cylinder 8 puts the clamper 7b in a square hole 1a' of a lead frame 1a, while the clamper 7a contacts one end of the lead frame 1a, and thus another cylinder 9 shuts the clamper 7b to provide fast grasp. The undermost one 1a is forcedly separated by the cylinder 8 and transported by a transport part 10. Thus the lead frames 1 are separated surely one after another, that enhances the rate of service.
JP62202488A 1987-08-13 1987-08-13 Lead frame supply device for semiconductor mounting device Expired - Lifetime JPH0694311B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62202488A JPH0694311B2 (en) 1987-08-13 1987-08-13 Lead frame supply device for semiconductor mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62202488A JPH0694311B2 (en) 1987-08-13 1987-08-13 Lead frame supply device for semiconductor mounting device

Publications (2)

Publication Number Publication Date
JPS6448728A true JPS6448728A (en) 1989-02-23
JPH0694311B2 JPH0694311B2 (en) 1994-11-24

Family

ID=16458331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62202488A Expired - Lifetime JPH0694311B2 (en) 1987-08-13 1987-08-13 Lead frame supply device for semiconductor mounting device

Country Status (1)

Country Link
JP (1) JPH0694311B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104803217A (en) * 2015-04-22 2015-07-29 杭州中亚机械股份有限公司 Separation device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4726879U (en) * 1971-04-15 1972-11-27
JPS61101544U (en) * 1984-12-11 1986-06-28

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4726879U (en) * 1971-04-15 1972-11-27
JPS61101544U (en) * 1984-12-11 1986-06-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104803217A (en) * 2015-04-22 2015-07-29 杭州中亚机械股份有限公司 Separation device

Also Published As

Publication number Publication date
JPH0694311B2 (en) 1994-11-24

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