JPS6448728A - Lead frame supplier of semiconductor mounting device - Google Patents
Lead frame supplier of semiconductor mounting deviceInfo
- Publication number
- JPS6448728A JPS6448728A JP62202488A JP20248887A JPS6448728A JP S6448728 A JPS6448728 A JP S6448728A JP 62202488 A JP62202488 A JP 62202488A JP 20248887 A JP20248887 A JP 20248887A JP S6448728 A JPS6448728 A JP S6448728A
- Authority
- JP
- Japan
- Prior art keywords
- lead frames
- accommodator
- clamper
- lead frame
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Sheets, Magazines, And Separation Thereof (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To provide stable operation by clamping the undermost one of the stacked lead frames in an accommodator with a set of clampers, separating downward forcedly, and thereby eliminating risk of taking-out of two or more pieces. CONSTITUTION:Lead frames 1 are stacked on accommodating guides 6a, 6b of an accommodator 6 and borne by a receipt pawl 2 situated below and a tapered part. Lead frames 1 in a plural number are pressed by a frame holder 4 so that no load is applied to the receipt pawl 2. Clampers 7a, 7b are provided below the accommodator 6, and rise of a cylinder 8 puts the clamper 7b in a square hole 1a' of a lead frame 1a, while the clamper 7a contacts one end of the lead frame 1a, and thus another cylinder 9 shuts the clamper 7b to provide fast grasp. The undermost one 1a is forcedly separated by the cylinder 8 and transported by a transport part 10. Thus the lead frames 1 are separated surely one after another, that enhances the rate of service.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62202488A JPH0694311B2 (en) | 1987-08-13 | 1987-08-13 | Lead frame supply device for semiconductor mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62202488A JPH0694311B2 (en) | 1987-08-13 | 1987-08-13 | Lead frame supply device for semiconductor mounting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6448728A true JPS6448728A (en) | 1989-02-23 |
JPH0694311B2 JPH0694311B2 (en) | 1994-11-24 |
Family
ID=16458331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62202488A Expired - Lifetime JPH0694311B2 (en) | 1987-08-13 | 1987-08-13 | Lead frame supply device for semiconductor mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0694311B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104803217A (en) * | 2015-04-22 | 2015-07-29 | 杭州中亚机械股份有限公司 | Separation device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4726879U (en) * | 1971-04-15 | 1972-11-27 | ||
JPS61101544U (en) * | 1984-12-11 | 1986-06-28 |
-
1987
- 1987-08-13 JP JP62202488A patent/JPH0694311B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4726879U (en) * | 1971-04-15 | 1972-11-27 | ||
JPS61101544U (en) * | 1984-12-11 | 1986-06-28 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104803217A (en) * | 2015-04-22 | 2015-07-29 | 杭州中亚机械股份有限公司 | Separation device |
Also Published As
Publication number | Publication date |
---|---|
JPH0694311B2 (en) | 1994-11-24 |
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