JPS6447044U - - Google Patents
Info
- Publication number
 - JPS6447044U JPS6447044U JP14096887U JP14096887U JPS6447044U JP S6447044 U JPS6447044 U JP S6447044U JP 14096887 U JP14096887 U JP 14096887U JP 14096887 U JP14096887 U JP 14096887U JP S6447044 U JPS6447044 U JP S6447044U
 - Authority
 - JP
 - Japan
 - Prior art keywords
 - semiconductor wafers
 - shaped
 - tweezers
 - iofluorinated
 - ethylene
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Granted
 
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
 - 235000012431 wafers Nutrition 0.000 claims description 5
 - 210000000078 claw Anatomy 0.000 claims description 3
 - 229920006026 co-polymeric resin Polymers 0.000 claims 2
 - QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims 1
 - 239000011248 coating agent Substances 0.000 claims 1
 - 238000000576 coating method Methods 0.000 claims 1
 - HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims 1
 - NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
 - 239000002184 metal Substances 0.000 claims 1
 - 229920005989 resin Polymers 0.000 claims 1
 - 239000011347 resin Substances 0.000 claims 1
 
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
 
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1987140968U JPH0617294Y2 (ja) | 1987-09-17 | 1987-09-17 | 半導体ウェハ用ピンセット | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP1987140968U JPH0617294Y2 (ja) | 1987-09-17 | 1987-09-17 | 半導体ウェハ用ピンセット | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS6447044U true JPS6447044U (forum.php) | 1989-03-23 | 
| JPH0617294Y2 JPH0617294Y2 (ja) | 1994-05-02 | 
Family
ID=31405614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP1987140968U Expired - Lifetime JPH0617294Y2 (ja) | 1987-09-17 | 1987-09-17 | 半導体ウェハ用ピンセット | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPH0617294Y2 (forum.php) | 
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS60142067U (ja) * | 1984-02-28 | 1985-09-20 | 松下電子工業株式会社 | ウエ−ハ保持具 | 
- 
        1987
        
- 1987-09-17 JP JP1987140968U patent/JPH0617294Y2/ja not_active Expired - Lifetime
 
 
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS60142067U (ja) * | 1984-02-28 | 1985-09-20 | 松下電子工業株式会社 | ウエ−ハ保持具 | 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPH0617294Y2 (ja) | 1994-05-02 |