JPS6445756U - - Google Patents

Info

Publication number
JPS6445756U
JPS6445756U JP1987138582U JP13858287U JPS6445756U JP S6445756 U JPS6445756 U JP S6445756U JP 1987138582 U JP1987138582 U JP 1987138582U JP 13858287 U JP13858287 U JP 13858287U JP S6445756 U JPS6445756 U JP S6445756U
Authority
JP
Japan
Prior art keywords
laser
workpiece
processing device
pulse frequency
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987138582U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987138582U priority Critical patent/JPS6445756U/ja
Publication of JPS6445756U publication Critical patent/JPS6445756U/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示すブロツク図、
第2図a〜cは第1図の動作を示すタイムチヤー
ト、第3図aは本実施例を適用した場合の溶込み
形状図、同図bは従来装置における溶込み形状図
、第4図は従来のレーザ加工装置のブロツク図、
第5図a〜cは第4図の動作を示すタイムチヤー
トである。 1はレーザ発振器、2,21はレーザパワー制
御装置、3はレーザ光、4は第1ベンドミラー、
5は集光レンズ、6はスキヤナーミラー、7は第
2ベンドミラー、8はワーク、9はパルス発生器
、10はスキヤナー用増幅器、11はスキヤナー
モータを示す。なお、各図中、同一符号は同一又
は相当部分を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) レーザ発振器と、該レーザ発振器より出力
    されたレーザビームをワーク上へ導出する光学機
    構と、ワーク上におけるレーザビームの集光位置
    を周期的に連続変化させるビームスキヤナー装置
    とを備えたレーザ加工装置において、上記レーザ
    出力をパルス化する手段と、レーザパルス周波数
    とビームスキヤン周期とを同期させる手段とを備
    えたことを特徴とするレーザ加工装置。 (2) 上記レーザ発振器のパルス周波数信号によ
    り、上記ビームスキヤナー装置の走査周期を制御
    することを特徴とする実用新案登録請求の範囲第
    1項記載のレーザ加工装置。
JP1987138582U 1987-09-10 1987-09-10 Pending JPS6445756U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138582U JPS6445756U (ja) 1987-09-10 1987-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138582U JPS6445756U (ja) 1987-09-10 1987-09-10

Publications (1)

Publication Number Publication Date
JPS6445756U true JPS6445756U (ja) 1989-03-20

Family

ID=31401046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138582U Pending JPS6445756U (ja) 1987-09-10 1987-09-10

Country Status (1)

Country Link
JP (1) JPS6445756U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006057856A2 (en) 2004-11-17 2006-06-01 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
JP2009154198A (ja) * 2007-12-27 2009-07-16 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工制御装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006057856A2 (en) 2004-11-17 2006-06-01 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
EP1812195A2 (en) * 2004-11-17 2007-08-01 Metal Improvement Company, LLC. Active beam delivery system for laser peening and laser peening method
EP1812195A4 (en) * 2004-11-17 2011-10-19 Metal Improvement Company Llc ACTIVE BEAM TRANSMISSION SYSTEM FOR LASER DRYING AND LASER TURNING METHOD
JP2009154198A (ja) * 2007-12-27 2009-07-16 Mitsubishi Electric Corp レーザ加工装置およびレーザ加工制御装置
JP4509174B2 (ja) * 2007-12-27 2010-07-21 三菱電機株式会社 レーザ加工装置およびレーザ加工制御装置

Similar Documents

Publication Publication Date Title
JPS6445756U (ja)
JPS6267689U (ja)
JPH04483U (ja)
JPH0370876U (ja)
JPH01197088A (ja) レーザ加工装置
JPH0418314U (ja)
JPH026183U (ja)
JPS63116195U (ja)
JPH0336378U (ja)
JPS5811265U (ja) レ−ザ光照射装置
JPS62167215U (ja)
JPS5828787U (ja) レ−ザ加工装置
JPH0397950U (ja)
JPH03116284U (ja)
JPH01109389U (ja)
JPH0426684U (ja)
JPH0174491U (ja)
JPS6410387U (ja)
JPS62177069U (ja)
JPS6355992A (ja) レ−ザ加工装置
JPH0457813U (ja)
JPH01122680A (ja) レーザ加工機用距離計測装置
JPS62168460A (ja) 撮像装置
JPH0334263U (ja)
JPS6229886U (ja)