JPS6444094A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPS6444094A
JPS6444094A JP19972687A JP19972687A JPS6444094A JP S6444094 A JPS6444094 A JP S6444094A JP 19972687 A JP19972687 A JP 19972687A JP 19972687 A JP19972687 A JP 19972687A JP S6444094 A JPS6444094 A JP S6444094A
Authority
JP
Japan
Prior art keywords
adhesive
component
extending
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19972687A
Other languages
Japanese (ja)
Inventor
Takao Harakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19972687A priority Critical patent/JPS6444094A/en
Publication of JPS6444094A publication Critical patent/JPS6444094A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To control an adhesive extending direction, or to keep the extension of the adhesive within an allowable limit by forming at least one recess on the surface of a component opposite to a component. CONSTITUTION:If the volume of an adhesive 5 is smaller than a space between a printed circuit substrate 1 and a surface mounting component 3 when the component is retained to bond it, there is no possibility of extending the adhesive up to an electrode pattern 2, thereby not disturbing solderability. When the component 3 is retained on the substrate 1, the direction of extending the adhesive 5 is determined in advance in a direction having no electrode pattern. Thus, since it can prevent the pattern from contaminating with the adhesive, it can reduce improper soldering rate.
JP19972687A 1987-08-12 1987-08-12 Printed wiring board Pending JPS6444094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19972687A JPS6444094A (en) 1987-08-12 1987-08-12 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19972687A JPS6444094A (en) 1987-08-12 1987-08-12 Printed wiring board

Publications (1)

Publication Number Publication Date
JPS6444094A true JPS6444094A (en) 1989-02-16

Family

ID=16412595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19972687A Pending JPS6444094A (en) 1987-08-12 1987-08-12 Printed wiring board

Country Status (1)

Country Link
JP (1) JPS6444094A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5404408A (en) * 1991-06-28 1995-04-04 Siemens Aktiengesellschaft Miniature hearing aid to be worn on the head, and a method for the manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5404408A (en) * 1991-06-28 1995-04-04 Siemens Aktiengesellschaft Miniature hearing aid to be worn on the head, and a method for the manufacture thereof

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