JPS6442890A - Printed substrate - Google Patents

Printed substrate

Info

Publication number
JPS6442890A
JPS6442890A JP19905687A JP19905687A JPS6442890A JP S6442890 A JPS6442890 A JP S6442890A JP 19905687 A JP19905687 A JP 19905687A JP 19905687 A JP19905687 A JP 19905687A JP S6442890 A JPS6442890 A JP S6442890A
Authority
JP
Japan
Prior art keywords
dielectric
face
porous
layer
fluoroplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19905687A
Other languages
Japanese (ja)
Inventor
Minoru Hatakeyama
Haruo Nomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Gore Tex Inc
Original Assignee
Japan Gore Tex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Gore Tex Inc filed Critical Japan Gore Tex Inc
Priority to JP19905687A priority Critical patent/JPS6442890A/en
Publication of JPS6442890A publication Critical patent/JPS6442890A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a substrate excellent in relative permittivity and a dielectric property such as a dielectric loss tangent by a method wherein an electric circuit is provided on one face of a porous fluoroplastic dielectric and a conductor is provided on the other face of it or inside the layer of it. CONSTITUTION:A circuit layer 2 constituting an electric circuit is provided on one face of a porous fluoroplastic dielectric 1 through the intermediary of a bonding layer 4 and further a conductor 3 is formed on the other face of the dielectric 1 through the intermediary of a bonding layer 5. A porous fluoroplastic dielectric such as a porous polytetrafluoroethylene(PTFE) excellent in weather, chemicals, heat, and low-temperature resistance is desirable. And, a fluoroplastic fiber is made to be more improved not only in a mechanical strength but also in a dielectric property when it is porous itself. Furthermore, when a conductor is provided on the face of or inside the layer of the part of a porous fluoroplastic dielectric that a circuit layer is not built, the transmission of a radiated electromagnetic wave is prevented, so that noise caused by the reflection of the transmitted electromagnetic wave or the like is gotten rid of.
JP19905687A 1987-08-11 1987-08-11 Printed substrate Pending JPS6442890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19905687A JPS6442890A (en) 1987-08-11 1987-08-11 Printed substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19905687A JPS6442890A (en) 1987-08-11 1987-08-11 Printed substrate

Publications (1)

Publication Number Publication Date
JPS6442890A true JPS6442890A (en) 1989-02-15

Family

ID=16401371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19905687A Pending JPS6442890A (en) 1987-08-11 1987-08-11 Printed substrate

Country Status (1)

Country Link
JP (1) JPS6442890A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02296389A (en) * 1989-05-11 1990-12-06 Japan Gore Tex Inc Printed circuit board
JPH0368149A (en) * 1989-08-07 1991-03-25 Japan Gore Tex Inc Ic mounting film carrier
JP2009190212A (en) * 2008-02-13 2009-08-27 Toho Kasei Kk Insulated substrate material for high-frequency band
JP2012033752A (en) * 2010-07-30 2012-02-16 Nitto Denko Corp Wiring circuit board and method of manufacturing the same
WO2015118858A1 (en) * 2014-02-04 2015-08-13 日東電工株式会社 Method for producing thermally conductive sheet, and thermally conductive sheet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255991A (en) * 1985-09-05 1987-03-11 住友電気工業株式会社 Flexible printed circuit board with shield
JPS6255992A (en) * 1985-09-05 1987-03-11 住友電気工業株式会社 Flexible printed circuit board with shield

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6255991A (en) * 1985-09-05 1987-03-11 住友電気工業株式会社 Flexible printed circuit board with shield
JPS6255992A (en) * 1985-09-05 1987-03-11 住友電気工業株式会社 Flexible printed circuit board with shield

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02296389A (en) * 1989-05-11 1990-12-06 Japan Gore Tex Inc Printed circuit board
JPH0368149A (en) * 1989-08-07 1991-03-25 Japan Gore Tex Inc Ic mounting film carrier
JP2009190212A (en) * 2008-02-13 2009-08-27 Toho Kasei Kk Insulated substrate material for high-frequency band
JP2012033752A (en) * 2010-07-30 2012-02-16 Nitto Denko Corp Wiring circuit board and method of manufacturing the same
US9288903B2 (en) 2010-07-30 2016-03-15 Nitto Denko Corporation Printed circuit board and method of manufacturing the same
WO2015118858A1 (en) * 2014-02-04 2015-08-13 日東電工株式会社 Method for producing thermally conductive sheet, and thermally conductive sheet

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