JPS644285B2 - - Google Patents

Info

Publication number
JPS644285B2
JPS644285B2 JP59077401A JP7740184A JPS644285B2 JP S644285 B2 JPS644285 B2 JP S644285B2 JP 59077401 A JP59077401 A JP 59077401A JP 7740184 A JP7740184 A JP 7740184A JP S644285 B2 JPS644285 B2 JP S644285B2
Authority
JP
Japan
Prior art keywords
silicon carbide
substrate
weight
sintered body
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59077401A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6084713A (ja
Inventor
Yasuo Matsushita
Yukio Takeda
Kosuke Nakamura
Tokio Oogoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59077401A priority Critical patent/JPS6084713A/ja
Publication of JPS6084713A publication Critical patent/JPS6084713A/ja
Publication of JPS644285B2 publication Critical patent/JPS644285B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Inorganic Insulating Materials (AREA)
JP59077401A 1984-04-16 1984-04-16 電気絶縁材の製造法 Granted JPS6084713A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59077401A JPS6084713A (ja) 1984-04-16 1984-04-16 電気絶縁材の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59077401A JPS6084713A (ja) 1984-04-16 1984-04-16 電気絶縁材の製造法

Publications (2)

Publication Number Publication Date
JPS6084713A JPS6084713A (ja) 1985-05-14
JPS644285B2 true JPS644285B2 (cg-RX-API-DMAC7.html) 1989-01-25

Family

ID=13632875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59077401A Granted JPS6084713A (ja) 1984-04-16 1984-04-16 電気絶縁材の製造法

Country Status (1)

Country Link
JP (1) JPS6084713A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11426772B2 (en) 2015-05-13 2022-08-30 Sloan Water Technology Limited Cleaning apparatus and method of using an acoustic transducer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954483A (en) * 1974-01-08 1976-05-04 General Electric Company Dense polycrystalline silicon carbide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11426772B2 (en) 2015-05-13 2022-08-30 Sloan Water Technology Limited Cleaning apparatus and method of using an acoustic transducer

Also Published As

Publication number Publication date
JPS6084713A (ja) 1985-05-14

Similar Documents

Publication Publication Date Title
US4585706A (en) Sintered aluminum nitride semi-conductor device
US4571610A (en) Semiconductor device having electrically insulating substrate of SiC
EP0081365B1 (en) Electrically insulating silicon carbide sintered body
JPH0261539B2 (cg-RX-API-DMAC7.html)
JP2006505951A (ja) 銅／ダイヤモンドの複合材料を有する半導体基板及びその製造方法
JPH054950B2 (cg-RX-API-DMAC7.html)
JPS5831755B2 (ja) 電気絶縁用基体
JPS5832073A (ja) 焼結体
JPH1067560A (ja) 高熱伝導率セラミックスおよびその製造方法
JPS644285B2 (cg-RX-API-DMAC7.html)
JPH0870036A (ja) 静電チャック
JP2004160549A (ja) セラミックス−金属複合体およびこれを用いた高熱伝導放熱用基板
JPS6342414B2 (cg-RX-API-DMAC7.html)
JPS5969473A (ja) 電気絶縁性焼結材用炭化けい素粉末組成物
JPS631270B2 (cg-RX-API-DMAC7.html)
JPH0470775B2 (cg-RX-API-DMAC7.html)
JPS6084843A (ja) 半導体素子塔載用基板
JPS6140870A (ja) 電気絶縁材
US3702787A (en) Method of forming ohmic contact for semiconducting devices
JP2967065B2 (ja) 半導体モジュール
JP3180100B2 (ja) 半導体モジュール
JPS5815953B2 (ja) 電気的装置用基板
JPH02132847A (ja) セラミックス放熱フィン付半導体装置
JPH0445993B2 (cg-RX-API-DMAC7.html)
JPH0247856B2 (cg-RX-API-DMAC7.html)