JPS6442594A - Silver-tin alloy plating bath - Google Patents

Silver-tin alloy plating bath

Info

Publication number
JPS6442594A
JPS6442594A JP19890787A JP19890787A JPS6442594A JP S6442594 A JPS6442594 A JP S6442594A JP 19890787 A JP19890787 A JP 19890787A JP 19890787 A JP19890787 A JP 19890787A JP S6442594 A JPS6442594 A JP S6442594A
Authority
JP
Japan
Prior art keywords
silver
tin
plating bath
cyanide
salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19890787A
Other languages
Japanese (ja)
Other versions
JPH0321638B2 (en
Inventor
Hidehiko Enomoto
Seiichiro Kusama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MITSUYA CORP
Osaka City
Mitsuya KK
Original Assignee
MITSUYA CORP
Osaka City
Mitsuya KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MITSUYA CORP, Osaka City, Mitsuya KK filed Critical MITSUYA CORP
Priority to JP19890787A priority Critical patent/JPS6442594A/en
Publication of JPS6442594A publication Critical patent/JPS6442594A/en
Publication of JPH0321638B2 publication Critical patent/JPH0321638B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a silver-tin alloy plating bath having high stability and forming a high quality plating film in a wide current density range by preparing an aq. soln. contg. a silver compd., a bivalent tin salt, sodium cyanide, saccharic acid, etc. CONSTITUTION:An aq. soln. contg. a silver compd. such as silver cyanide, a bivalent tin salt such as tin chloride, sodium cyanide and/or potassium cyanide as a silver complexing agent and at least one among saccharic acid, a salt thereof, aldonic acid, a salt thereof and sugar alcohol as a thin complexing agent is prepd. as a silver-tin alloy plating bath. The amt. of the silver component used is about 1-50g/l and that of the tin component used is about 1-40g/l and about 1-5mol. per 1mol. silver component. The amt. of the cyanide used is about 1-300g/l and about 2-10mol. per 1mol. silver. The amt. of the saccharic acid, etc., used is about 1-500g/l and about 2-20mol. per 1mol. thin. When the plating bath is used, a high quality smooth plating film is formed.
JP19890787A 1987-08-07 1987-08-07 Silver-tin alloy plating bath Granted JPS6442594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19890787A JPS6442594A (en) 1987-08-07 1987-08-07 Silver-tin alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19890787A JPS6442594A (en) 1987-08-07 1987-08-07 Silver-tin alloy plating bath

Publications (2)

Publication Number Publication Date
JPS6442594A true JPS6442594A (en) 1989-02-14
JPH0321638B2 JPH0321638B2 (en) 1991-03-25

Family

ID=16398928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19890787A Granted JPS6442594A (en) 1987-08-07 1987-08-07 Silver-tin alloy plating bath

Country Status (1)

Country Link
JP (1) JPS6442594A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183216A (en) * 2014-03-24 2015-10-22 Jx日鉱日石金属株式会社 ELECTRONIC COMPONENT HAVING Ag-Sn ALLOY PLATING FILM, AND MANUFACTURING METHOD OF Ag-Sn PLATING SOLUTION AND THE ELECTRONIC COMPONENT
JP2017190477A (en) * 2016-04-12 2017-10-19 日本エレクトロプレイテイング・エンジニヤース株式会社 NON-CYAN-BASED Au-Sn ALLOY PLATING LIQUID
WO2022153740A1 (en) * 2021-01-13 2022-07-21 三菱マテリアル株式会社 Tin alloy plating solution

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183216A (en) * 2014-03-24 2015-10-22 Jx日鉱日石金属株式会社 ELECTRONIC COMPONENT HAVING Ag-Sn ALLOY PLATING FILM, AND MANUFACTURING METHOD OF Ag-Sn PLATING SOLUTION AND THE ELECTRONIC COMPONENT
JP2017190477A (en) * 2016-04-12 2017-10-19 日本エレクトロプレイテイング・エンジニヤース株式会社 NON-CYAN-BASED Au-Sn ALLOY PLATING LIQUID
WO2022153740A1 (en) * 2021-01-13 2022-07-21 三菱マテリアル株式会社 Tin alloy plating solution

Also Published As

Publication number Publication date
JPH0321638B2 (en) 1991-03-25

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