JPS6441957A - Manufacture of electronic equipment - Google Patents
Manufacture of electronic equipmentInfo
- Publication number
- JPS6441957A JPS6441957A JP62197804A JP19780487A JPS6441957A JP S6441957 A JPS6441957 A JP S6441957A JP 62197804 A JP62197804 A JP 62197804A JP 19780487 A JP19780487 A JP 19780487A JP S6441957 A JPS6441957 A JP S6441957A
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- adhesives
- transfer head
- head
- tip surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Calculators And Similar Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To automate a bonding work by main-transferring at least to either of a case member and electronic parts after adhesives are temporarily transferred to a transfer head and after that, bonding the case member and the electronic parts through the adhesives. CONSTITUTION:A roll-shaped transfer sheet 40 to direct an adhesives 15 surface toward a top face side is sent out and stopped. A transfer head 50 is descended by a driving mechanism, the tip surface of respective transfer pins 51 is pressured from the upper direction to the layer of the adhesives 15 of the transfer sheet 40 on a base plate, the adhesive 15 are bonded to the resin film provided on the tip surface of respective transfer pins and the temporary transfer is executed. Next, the transfer head 50 is moved in the upper direction of the lower part case of the transfer head 50. The transfer head 50 is descended, the adhesives 15 temporarily transferred on the tip surface of respective transfer pins 51 are bonded onto the surface of respective adhesives transfer places of the lower part case and the main transfer is executed.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62197804A JPS6441957A (en) | 1987-08-07 | 1987-08-07 | Manufacture of electronic equipment |
KR1019880002234A KR910004797B1 (en) | 1987-04-08 | 1988-03-04 | Mini-electronic device and its manufacturing method |
US07/178,236 US5038251A (en) | 1987-04-08 | 1988-04-06 | Electronic apparatus and a method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62197804A JPS6441957A (en) | 1987-08-07 | 1987-08-07 | Manufacture of electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6441957A true JPS6441957A (en) | 1989-02-14 |
Family
ID=16380625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62197804A Pending JPS6441957A (en) | 1987-04-08 | 1987-08-07 | Manufacture of electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6441957A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007058667A (en) * | 2005-08-25 | 2007-03-08 | Konica Minolta Photo Imaging Inc | Ic card |
-
1987
- 1987-08-07 JP JP62197804A patent/JPS6441957A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007058667A (en) * | 2005-08-25 | 2007-03-08 | Konica Minolta Photo Imaging Inc | Ic card |
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