JPS644046A - Foreign matter inspection device - Google Patents

Foreign matter inspection device

Info

Publication number
JPS644046A
JPS644046A JP15774087A JP15774087A JPS644046A JP S644046 A JPS644046 A JP S644046A JP 15774087 A JP15774087 A JP 15774087A JP 15774087 A JP15774087 A JP 15774087A JP S644046 A JPS644046 A JP S644046A
Authority
JP
Japan
Prior art keywords
foreign matter
inspection
detected
inspection data
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15774087A
Other languages
Japanese (ja)
Inventor
Kazunari Kobayashi
Yumiko Shiihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi ULSI Engineering Corp
Hitachi Ltd
Original Assignee
Hitachi ULSI Engineering Corp
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi ULSI Engineering Corp, Hitachi Ltd filed Critical Hitachi ULSI Engineering Corp
Priority to JP15774087A priority Critical patent/JPS644046A/en
Publication of JPS644046A publication Critical patent/JPS644046A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To reduce a generation frequency of a false report due to randomly generated noise by a method wherein inspection data of a foreign matter adhering to an object to be inspected is held and controlled and the held inspection data is processed by computation. CONSTITUTION:A whole area on the surface of a semiconductor wafer 2 is irradiated with a laser beam 4; the scattered light 7 generated by a foreign matter 6 is detected by using an optical detection device 8. An inspection data of the foreign matter 6 by this device is held by a data holding device 9. An inspection operation of the foreign matter 6 on the identical semiconductor wafer 2 is repeated two times. Normally, a false report due to noise or the like is included in the inspection data in addition to the inspection data obtained by an inspection of the scattered light from an actually existing foreign matter 6. If a first inspection result is compared with a second inspection result, there are the foreign body 6 detected in an identical position and the foreign matter 6 detected in a different position. In this case, the foreign matter 6 detected in the identical position during a second inspection is treated as the foreign matter 6 which actually exists in the position. The foreign matter 6 which is detected only once in the identical position is treated as the foreign matter 6 which does not exist actually and is treated as the false report due to the noise or the like.
JP15774087A 1987-06-26 1987-06-26 Foreign matter inspection device Pending JPS644046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15774087A JPS644046A (en) 1987-06-26 1987-06-26 Foreign matter inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15774087A JPS644046A (en) 1987-06-26 1987-06-26 Foreign matter inspection device

Publications (1)

Publication Number Publication Date
JPS644046A true JPS644046A (en) 1989-01-09

Family

ID=15656316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15774087A Pending JPS644046A (en) 1987-06-26 1987-06-26 Foreign matter inspection device

Country Status (1)

Country Link
JP (1) JPS644046A (en)

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