JPS6439737A - Resin sealing device for semiconductor device - Google Patents

Resin sealing device for semiconductor device

Info

Publication number
JPS6439737A
JPS6439737A JP19680287A JP19680287A JPS6439737A JP S6439737 A JPS6439737 A JP S6439737A JP 19680287 A JP19680287 A JP 19680287A JP 19680287 A JP19680287 A JP 19680287A JP S6439737 A JPS6439737 A JP S6439737A
Authority
JP
Japan
Prior art keywords
resin
plunger
pot
package
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19680287A
Other languages
Japanese (ja)
Other versions
JP2866867B2 (en
Inventor
Suekichi Tanaka
Koji Tsutsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62196802A priority Critical patent/JP2866867B2/en
Publication of JPS6439737A publication Critical patent/JPS6439737A/en
Application granted granted Critical
Publication of JP2866867B2 publication Critical patent/JP2866867B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/586—Injection or transfer plungers

Abstract

PURPOSE:To evacuate in vacuum a pot and a cavity before pressurizing resin and to form a package having no void by forming a discharging passage communicating with the cavity and the pot in a metal mold for forming a semiconductor resin sealing package, and connecting a suction unit thereto. CONSTITUTION:A space 23 is formed of communicating grooves 21, 22 communicating with both cavities 6, 7. A discharging hole 24 for forming a first discharging passage is opened out of a metal mold 1. A second discharging passage 27 opened with the inside and the outside of a pot 10 is formed due to the diameter difference from a sealing pin 28 in a plunger 11. The receiving face 11a of the plunger 11 is in contact with the receiving face 28a of the pin 29 to apply the injecting pressure of the plunger to synthetic resin 1. A suction unit is driven before pressurizing the resin to discharge air in the cavities 6, 7 from discharging passages 25, 27 to the exterior to eliminate the formation of surface and interior void of the package 5 due to the invasion of the air into synthetic resin 14 at the time of pressurizing the resin.
JP62196802A 1987-08-05 1987-08-05 Resin sealing device and resin sealing method for semiconductor device Expired - Lifetime JP2866867B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196802A JP2866867B2 (en) 1987-08-05 1987-08-05 Resin sealing device and resin sealing method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196802A JP2866867B2 (en) 1987-08-05 1987-08-05 Resin sealing device and resin sealing method for semiconductor device

Publications (2)

Publication Number Publication Date
JPS6439737A true JPS6439737A (en) 1989-02-10
JP2866867B2 JP2866867B2 (en) 1999-03-08

Family

ID=16363892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196802A Expired - Lifetime JP2866867B2 (en) 1987-08-05 1987-08-05 Resin sealing device and resin sealing method for semiconductor device

Country Status (1)

Country Link
JP (1) JP2866867B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745651A (en) * 1991-01-17 1995-02-14 Towa Kk Method for sealing electronic parts with resin
EP0711647A1 (en) * 1994-10-24 1996-05-15 Texas Instruments Incorporated Improvements in or relating to encapsulating devices
CN112829179A (en) * 2020-12-31 2021-05-25 华芯智造微电子(重庆)有限公司 Plastic packaging press

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868940A (en) * 1981-10-20 1983-04-25 Oki Electric Ind Co Ltd Transfer molding press for plastic molded type semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868940A (en) * 1981-10-20 1983-04-25 Oki Electric Ind Co Ltd Transfer molding press for plastic molded type semiconductor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745651A (en) * 1991-01-17 1995-02-14 Towa Kk Method for sealing electronic parts with resin
EP0711647A1 (en) * 1994-10-24 1996-05-15 Texas Instruments Incorporated Improvements in or relating to encapsulating devices
CN112829179A (en) * 2020-12-31 2021-05-25 华芯智造微电子(重庆)有限公司 Plastic packaging press

Also Published As

Publication number Publication date
JP2866867B2 (en) 1999-03-08

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