JPS5721828A - Molding die for semiconductor device and molding method - Google Patents

Molding die for semiconductor device and molding method

Info

Publication number
JPS5721828A
JPS5721828A JP9720780A JP9720780A JPS5721828A JP S5721828 A JPS5721828 A JP S5721828A JP 9720780 A JP9720780 A JP 9720780A JP 9720780 A JP9720780 A JP 9720780A JP S5721828 A JPS5721828 A JP S5721828A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
molding
cull
liner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9720780A
Other languages
Japanese (ja)
Inventor
Katsuhiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9720780A priority Critical patent/JPS5721828A/en
Publication of JPS5721828A publication Critical patent/JPS5721828A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Abstract

PURPOSE:To enhance the reliability of a semiconductor device by providing a groove, a pressure reduction leakage preventing packing a suction port, and a vacuum pump at the mold in which molding resin is filled, evacuating the mold, and molding it, thereby defoaming the air in the resin. CONSTITUTION:A liner 4 communicates with a cull 3 formed at the center on the butting faces of lower die 1 and an upper die 2 elevationally movable, and a plurality of cavities 6 communicate via respective gates 5 with the liner 4. A vacuum pressure leakage preventing packing 8 is engaged with the groove 7 formed on the peripheral edge of the facing surface A of the upper die. A vacuum pump 12 communicates via a passage 10 with the suction port 9 adjacent to the cull 3. The cull, liner, gate and cavities to be filled with sealing rasin are in vacuum state on the facing surfaces of the upper and lower dies by operating the vacuum pump to be sealed with resin mold. Thus, it can prevent the occurrence of bond in the sealing resin of the semiconductor device.
JP9720780A 1980-07-16 1980-07-16 Molding die for semiconductor device and molding method Pending JPS5721828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9720780A JPS5721828A (en) 1980-07-16 1980-07-16 Molding die for semiconductor device and molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9720780A JPS5721828A (en) 1980-07-16 1980-07-16 Molding die for semiconductor device and molding method

Publications (1)

Publication Number Publication Date
JPS5721828A true JPS5721828A (en) 1982-02-04

Family

ID=14186168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9720780A Pending JPS5721828A (en) 1980-07-16 1980-07-16 Molding die for semiconductor device and molding method

Country Status (1)

Country Link
JP (1) JPS5721828A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02103941A (en) * 1988-10-13 1990-04-17 Mitsubishi Electric Corp Resin sealing method for semiconductor element and vacuum type resin sealing apparatus and long lead frame used in the method
US6613180B2 (en) * 2001-08-03 2003-09-02 Matsushita Electric Industrial Co., Ltd. Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02103941A (en) * 1988-10-13 1990-04-17 Mitsubishi Electric Corp Resin sealing method for semiconductor element and vacuum type resin sealing apparatus and long lead frame used in the method
US6613180B2 (en) * 2001-08-03 2003-09-02 Matsushita Electric Industrial Co., Ltd. Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body

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