JPS6438212A - Conductive molded body and its preparation - Google Patents
Conductive molded body and its preparationInfo
- Publication number
- JPS6438212A JPS6438212A JP19454187A JP19454187A JPS6438212A JP S6438212 A JPS6438212 A JP S6438212A JP 19454187 A JP19454187 A JP 19454187A JP 19454187 A JP19454187 A JP 19454187A JP S6438212 A JPS6438212 A JP S6438212A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- molded body
- conductive filler
- layer
- high density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE:To obtain a conductive molded body having a base plate composed of a synthetic resin wherein a high density conductive layer is integrally provided to a surface layer or in the vicinity thereof, in the molding of a conductive resin composite due to a reactive injection molding method (RIM method) other than a norbornene resin molded body, by sedimenting a conductive filler in a mold before completing the polymerization of a reactive raw liquid. CONSTITUTION:When a conductive resin molded body (excepting a norbornene resin molded body) is prepared by an RIM method, a reactive raw liquid containing a conductive filler is injected in a mold and, subsequently, the conductive filler is sedimented to the lower part of the mold before polymerization is completed to make it possible to obtain a conductive molded body wherein a high density conductive layer composed of the conductive filler is integrally provided to the surface layer thereof or in the vicinity thereof. The high density conductive layer composed of the mixture layer of the conductive filler and the resin pref. has density of 1.0g/cm<3> or more, a thickness of 0.1mm or more and the content of the conductive filler in the layer of 5vol.% or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19454187A JPS6438212A (en) | 1987-08-05 | 1987-08-05 | Conductive molded body and its preparation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19454187A JPS6438212A (en) | 1987-08-05 | 1987-08-05 | Conductive molded body and its preparation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6438212A true JPS6438212A (en) | 1989-02-08 |
Family
ID=16326248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19454187A Pending JPS6438212A (en) | 1987-08-05 | 1987-08-05 | Conductive molded body and its preparation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6438212A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05507758A (en) * | 1990-10-09 | 1993-11-04 | インタグリオ リミテッド | Plastic molded piece with the appearance of a solid metal piece |
-
1987
- 1987-08-05 JP JP19454187A patent/JPS6438212A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05507758A (en) * | 1990-10-09 | 1993-11-04 | インタグリオ リミテッド | Plastic molded piece with the appearance of a solid metal piece |
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