JPS6438170U - - Google Patents
Info
- Publication number
- JPS6438170U JPS6438170U JP13327687U JP13327687U JPS6438170U JP S6438170 U JPS6438170 U JP S6438170U JP 13327687 U JP13327687 U JP 13327687U JP 13327687 U JP13327687 U JP 13327687U JP S6438170 U JPS6438170 U JP S6438170U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- heating
- flat package
- soldered
- solidifying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13327687U JPS6438170U (enrdf_load_stackoverflow) | 1987-09-02 | 1987-09-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13327687U JPS6438170U (enrdf_load_stackoverflow) | 1987-09-02 | 1987-09-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6438170U true JPS6438170U (enrdf_load_stackoverflow) | 1989-03-07 |
Family
ID=31390988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13327687U Pending JPS6438170U (enrdf_load_stackoverflow) | 1987-09-02 | 1987-09-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6438170U (enrdf_load_stackoverflow) |
-
1987
- 1987-09-02 JP JP13327687U patent/JPS6438170U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6438170U (enrdf_load_stackoverflow) | ||
JPS6413101U (enrdf_load_stackoverflow) | ||
JPH01103272U (enrdf_load_stackoverflow) | ||
JPH05121411A (ja) | 電子部品における接続用バンプの形成方法 | |
JPS6018575U (ja) | プリント基板装置 | |
JPS6237992A (ja) | フラツトパツクicの半田付方法 | |
JPH0217854U (enrdf_load_stackoverflow) | ||
JPS6042763U (ja) | フラツトパツケ−ジ型集積回路装置用リフロ−ソルダリンダ装置の位置決め実装機構 | |
JPS58171890A (ja) | プリント基板のはんだ付方法 | |
JPS6384978U (enrdf_load_stackoverflow) | ||
JPS6376371U (enrdf_load_stackoverflow) | ||
JPS5844871U (ja) | 配線基板 | |
JPS60194375U (ja) | ホツトラム式半田付け治具 | |
JPH0325279U (enrdf_load_stackoverflow) | ||
JPS60149134U (ja) | 半導体装置の製造装置 | |
JPS63106575U (enrdf_load_stackoverflow) | ||
JPH02137051U (enrdf_load_stackoverflow) | ||
JPS5930371U (ja) | はんだ付け用予備加熱装置 | |
JPS63136352U (enrdf_load_stackoverflow) | ||
JPS5822763U (ja) | チツプ状部品の取付装置 | |
JPS6364079U (enrdf_load_stackoverflow) | ||
JPS6298255U (enrdf_load_stackoverflow) | ||
JPH02110374U (enrdf_load_stackoverflow) | ||
JPH0436249U (enrdf_load_stackoverflow) | ||
JPS62109481U (enrdf_load_stackoverflow) |