JPS6437871A - Solid-state image sensor - Google Patents
Solid-state image sensorInfo
- Publication number
- JPS6437871A JPS6437871A JP62194652A JP19465287A JPS6437871A JP S6437871 A JPS6437871 A JP S6437871A JP 62194652 A JP62194652 A JP 62194652A JP 19465287 A JP19465287 A JP 19465287A JP S6437871 A JPS6437871 A JP S6437871A
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- printed board
- solid
- state image
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
PURPOSE:To form a wiring by a lead, to stick a transparent cap to a sensor section with adhesives or sealing the cap to the sensor section with transparent glass or a resin and to miniaturize a video camera and reduce cost thereof by directly assembling a solid-state image sensor onto a printed board. CONSTITUTION:A solid-state image sensor 2 is stuck onto the surface of a printed board 1 consisting of bakelite or ceramics with silver paste, etc. The image sensor 2 is connected to wirings for the printed board 1 by leads 3 consisting of aluminum, copper, etc., and assembled. A transparent cap 5 is pasted onto the surface of the printed board 1 including the image sensor 2 with adhesives 4 composed of epoxy adhesive low melting-point glass. The solid-state image sensor 12 is assembled onto the surface of the printed board 11 together with the leads 13 in another case, and the upper section of the image sensor 12 is molded with transparent glass or a resin 15, thus miniaturizing a video camera and reducing cost thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62194652A JPS6437871A (en) | 1987-08-04 | 1987-08-04 | Solid-state image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62194652A JPS6437871A (en) | 1987-08-04 | 1987-08-04 | Solid-state image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437871A true JPS6437871A (en) | 1989-02-08 |
Family
ID=16328069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62194652A Pending JPS6437871A (en) | 1987-08-04 | 1987-08-04 | Solid-state image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437871A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425191A (en) * | 1990-05-18 | 1992-01-28 | Sharp Corp | Manufacture of semiconductor laser element |
| JPH05206427A (en) * | 1992-01-09 | 1993-08-13 | Nec Corp | Solid-state image sensing device |
| US5255279A (en) * | 1990-05-09 | 1993-10-19 | Sharp Kabushiki Kaisha | Semiconductor laser device, and a method for producing a compound semiconductor device including the semiconductor laser device |
| KR20040033193A (en) * | 2002-10-11 | 2004-04-21 | (주)그래픽테크노재팬 | Semiconductor Package For Image Sensor And Making Method |
| KR20110106707A (en) * | 2010-03-23 | 2011-09-29 | 삼성전자주식회사 | Method for wafer level package and semiconductor device used the same |
-
1987
- 1987-08-04 JP JP62194652A patent/JPS6437871A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5255279A (en) * | 1990-05-09 | 1993-10-19 | Sharp Kabushiki Kaisha | Semiconductor laser device, and a method for producing a compound semiconductor device including the semiconductor laser device |
| US5360762A (en) * | 1990-05-09 | 1994-11-01 | Sharp Kabushiki Kaisha | Semiconductor laser device, and a method for producing a compound semiconductor device including the semiconductor laser device |
| JPH0425191A (en) * | 1990-05-18 | 1992-01-28 | Sharp Corp | Manufacture of semiconductor laser element |
| JPH05206427A (en) * | 1992-01-09 | 1993-08-13 | Nec Corp | Solid-state image sensing device |
| KR20040033193A (en) * | 2002-10-11 | 2004-04-21 | (주)그래픽테크노재팬 | Semiconductor Package For Image Sensor And Making Method |
| WO2004034472A1 (en) * | 2002-10-11 | 2004-04-22 | Graphic Techno Japan Co., Ltd. | Semiconductor chip package for image sensor and method of making the same |
| KR20110106707A (en) * | 2010-03-23 | 2011-09-29 | 삼성전자주식회사 | Method for wafer level package and semiconductor device used the same |
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