JPS6436978U - - Google Patents
Info
- Publication number
- JPS6436978U JPS6436978U JP13291487U JP13291487U JPS6436978U JP S6436978 U JPS6436978 U JP S6436978U JP 13291487 U JP13291487 U JP 13291487U JP 13291487 U JP13291487 U JP 13291487U JP S6436978 U JPS6436978 U JP S6436978U
- Authority
- JP
- Japan
- Prior art keywords
- circuit formed
- flexible substrate
- adhesive
- circuit
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291487U JPS6436978U (cs) | 1987-08-31 | 1987-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13291487U JPS6436978U (cs) | 1987-08-31 | 1987-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436978U true JPS6436978U (cs) | 1989-03-06 |
Family
ID=31390311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13291487U Pending JPS6436978U (cs) | 1987-08-31 | 1987-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436978U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335844A (ja) * | 2003-05-09 | 2004-11-25 | Nec Corp | 回路基板装置およびその製造方法 |
-
1987
- 1987-08-31 JP JP13291487U patent/JPS6436978U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335844A (ja) * | 2003-05-09 | 2004-11-25 | Nec Corp | 回路基板装置およびその製造方法 |
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