JPS6436149U - - Google Patents
Info
- Publication number
- JPS6436149U JPS6436149U JP13016287U JP13016287U JPS6436149U JP S6436149 U JPS6436149 U JP S6436149U JP 13016287 U JP13016287 U JP 13016287U JP 13016287 U JP13016287 U JP 13016287U JP S6436149 U JPS6436149 U JP S6436149U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- sensitive
- substrate
- contact
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Facsimile Heads (AREA)
Description
第１図は本考案による感熱記録ヘツドの感熱素
子取付け構造の一実施例を示す斜視図、第２図は
第１図のＡ―Ａ′線の断面図、第３図は本考案の
一実施例により、画像を連続受信記録した際の放
熱板実測温度とサーミスタ検出温度とを連続測定
した図である。第４図は従来の感熱記録ヘツドの
感熱素子取付け構造の一例を示す斜視図、第５図
は従来例により、画像を連続受信記録した際の放
熱板実測温度とサーミスタ検出温度とを連続測定
した図である。
１……セラミツク基板、２……発熱抵抗体、３
……接着剤層、４……放熱板、５……プリント基
板、６……サーミスタ、７……水ガラス。
FIG. 1 is a perspective view showing an embodiment of the heat-sensitive element mounting structure of a heat-sensitive recording head according to the present invention, FIG. 2 is a sectional view taken along line A-A' in FIG. 1, and FIG. 3 is an embodiment of the present invention. As an example, it is a diagram in which the actual temperature of the heat sink and the temperature detected by the thermistor are continuously measured when images are continuously received and recorded. Fig. 4 is a perspective view showing an example of the heat-sensitive element mounting structure of a conventional heat-sensitive recording head, and Fig. 5 shows a conventional example in which the actual temperature of the heat sink and the temperature detected by the thermistor were continuously measured when images were continuously received and recorded. It is a diagram. 1...Ceramic substrate, 2...Heating resistor, 3
...adhesive layer, 4 ... heat sink, 5 ... printed circuit board, 6 ... thermistor, 7 ... water glass.
Claims (1)
状に設けられた第１の基板と、この第１の基板の
他方の面に設けられた放熱板と、この放熱板上で
前記第１の基板に並列して該一端長手方向が配設
された第２の基板と、この第２の基板の他端で一
方の面に電気的に接続された感熱素子と、この感
熱素子の感熱部と前記放熱板との間の熱伝導性を
保つた状態で前記感熱部を前記放熱面に当接保持
する当接保持手段とを具備したことを特徴とした
感熱記録ヘツドの感熱素子取付け構造。 (2) 当接保持手段が、熱伝導性を有し該断面が
Ω状に形成された保持部材により放熱板面に当接
された感熱部を保持するものであることを特徴と
する実用新案登録請求の範囲第(1)項記載の感熱
記録ヘツドの感熱素子取付け構造。 (3) 当接保持手段が、熱伝導性を有した接着剤
により放熱板面に当接された感熱部を包囲して保
持するものであることを特徴とする実用新案登録
請求の範囲第(1)項記載の感熱記録ヘツドの感熱
素子取付け構造。[Claims for Utility Model Registration] (1) A first substrate on which a plurality of heating resistors are linearly provided in the longitudinal direction of one surface, and a heat sink provided on the other surface of the first substrate. and a second substrate having one end longitudinally arranged in parallel with the first substrate on the heat sink, and the other end of the second substrate being electrically connected to one surface. It is characterized by comprising a heat-sensitive element and a contact holding means for holding the heat-sensitive part in contact with the heat-radiating surface while maintaining thermal conductivity between the heat-sensitive part of the heat-sensitive element and the heat-radiating plate. Thermal element mounting structure of the thermal recording head. (2) A utility model characterized in that the abutting and holding means holds the heat-sensitive part that is in contact with the heat sink surface by a holding member that is thermally conductive and has an Ω-shaped cross section. A structure for mounting a heat-sensitive element in a heat-sensitive recording head according to registered claim (1). (3) Utility model registration claim No. 1, characterized in that the contact holding means surrounds and holds the heat-sensitive part that is in contact with the heat sink surface using a thermally conductive adhesive ( The heat-sensitive element mounting structure of the heat-sensitive recording head described in item 1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13016287U JPS6436149U (en) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13016287U JPS6436149U (en) | 1987-08-28 | 1987-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6436149U true JPS6436149U (en) | 1989-03-06 |
Family
ID=31385083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13016287U Pending JPS6436149U (en) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6436149U (en) |
-
1987
- 1987-08-28 JP JP13016287U patent/JPS6436149U/ja active Pending
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