JPS6435986A - Preheating of soldered object in soldering device - Google Patents

Preheating of soldered object in soldering device

Info

Publication number
JPS6435986A
JPS6435986A JP19134187A JP19134187A JPS6435986A JP S6435986 A JPS6435986 A JP S6435986A JP 19134187 A JP19134187 A JP 19134187A JP 19134187 A JP19134187 A JP 19134187A JP S6435986 A JPS6435986 A JP S6435986A
Authority
JP
Japan
Prior art keywords
temperature
preheating
soldered
temporarily stopped
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19134187A
Other languages
Japanese (ja)
Inventor
Toshiji Kitajima
Mikio Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Co Ltd
Original Assignee
Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Co Ltd filed Critical Koki Co Ltd
Priority to JP19134187A priority Critical patent/JPS6435986A/en
Publication of JPS6435986A publication Critical patent/JPS6435986A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To uniformly heat an object to be soldered and to stably manage a temperature by reciprocating or rotating a heat source with respect to the element to be soldered and temporarily stopped. CONSTITUTION:A pretreaement, such as flux coating is performed while conveying an object 2 to be soldered, the object 2 is then preheated to a predetermined temperature, and then posttreated, such as soldering while passing it through a solder tank 3. In this case, the object 2 is temporarily stopped at the top of a preheating heat source body 4, which is reciprocated in a conveying direction of the object 2 or in a direction perpendicular to the conveying direction, and horizontally rotated to uniformly heat the object 2. Then the preheating temperature of the object 2 is detected by a temperature sensor provided at the body 4, the temporary stop of the object 2 is released by a signal representing the arrival of a set preheating temperature at the detected temperature, and again conveyed. Thus, a stable temperature can be managed.
JP19134187A 1987-07-30 1987-07-30 Preheating of soldered object in soldering device Pending JPS6435986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19134187A JPS6435986A (en) 1987-07-30 1987-07-30 Preheating of soldered object in soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19134187A JPS6435986A (en) 1987-07-30 1987-07-30 Preheating of soldered object in soldering device

Publications (1)

Publication Number Publication Date
JPS6435986A true JPS6435986A (en) 1989-02-07

Family

ID=16272952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19134187A Pending JPS6435986A (en) 1987-07-30 1987-07-30 Preheating of soldered object in soldering device

Country Status (1)

Country Link
JP (1) JPS6435986A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263569A (en) * 1989-04-03 1990-10-26 Hitachi Ltd Heating furnace
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263569A (en) * 1989-04-03 1990-10-26 Hitachi Ltd Heating furnace
US6257480B1 (en) 1998-07-07 2001-07-10 Denso Corporation Jet soldering method and apparatus

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