JPS6432624A - Aligner - Google Patents

Aligner

Info

Publication number
JPS6432624A
JPS6432624A JP62187744A JP18774487A JPS6432624A JP S6432624 A JPS6432624 A JP S6432624A JP 62187744 A JP62187744 A JP 62187744A JP 18774487 A JP18774487 A JP 18774487A JP S6432624 A JPS6432624 A JP S6432624A
Authority
JP
Japan
Prior art keywords
light
wafer
image
mask
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62187744A
Other languages
Japanese (ja)
Other versions
JP2554091B2 (en
Inventor
Keiji Kataoka
Toshishige Kurosaki
Seiji Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62187744A priority Critical patent/JP2554091B2/en
Priority to US07/224,654 priority patent/US4857744A/en
Publication of JPS6432624A publication Critical patent/JPS6432624A/en
Application granted granted Critical
Publication of JP2554091B2 publication Critical patent/JP2554091B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To align a mask pattern accurately to a resist on a wafer by image- forming the mask pattern on a mask by using a projection lens by exposure light, overlapping an image to an IC pattern formed onto the wafer and preparing the image. CONSTITUTION:A wafer mark 4 consisting of a lattice pattern on a wafer 3 is arranged so that the direction vertical to the direction of lattice pitches is directed toward the intersection of an optical axis passing through the center of a projection lens 2 and the wafer 3, and light having a wavelength different from the light 8 of a first light source is emitted. + or -primary diffracted light in reflected light from the wafer mark 4 is overlapped partially under the state of lateral displacement on a mask 1 in light from a second light source 10, reflected light from the wafer mark 4 is image-formed onto a photodetector 13 by a second optical system, and a filter 12 extracting only + or -primary diffracted light of reflected light is mounted onto the Fourier face of the second optical system, thus resulting in accurate alignment on the basis of a photodetecting signal.
JP62187744A 1987-07-29 1987-07-29 Exposure equipment Expired - Lifetime JP2554091B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62187744A JP2554091B2 (en) 1987-07-29 1987-07-29 Exposure equipment
US07/224,654 US4857744A (en) 1987-07-29 1988-07-27 Optical projection printing apparatus wherein wafer mark has a grating pitch in the sagittal plane of the first optical system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187744A JP2554091B2 (en) 1987-07-29 1987-07-29 Exposure equipment

Publications (2)

Publication Number Publication Date
JPS6432624A true JPS6432624A (en) 1989-02-02
JP2554091B2 JP2554091B2 (en) 1996-11-13

Family

ID=16211437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187744A Expired - Lifetime JP2554091B2 (en) 1987-07-29 1987-07-29 Exposure equipment

Country Status (1)

Country Link
JP (1) JP2554091B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120939A (en) * 1993-10-28 1995-05-12 Nec Corp Wafer positioning device
JPH09166877A (en) * 1995-12-18 1997-06-24 Hamamatsu Photonics Kk Production of optical semiconductor element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120939A (en) * 1993-10-28 1995-05-12 Nec Corp Wafer positioning device
JPH09166877A (en) * 1995-12-18 1997-06-24 Hamamatsu Photonics Kk Production of optical semiconductor element

Also Published As

Publication number Publication date
JP2554091B2 (en) 1996-11-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term