JPS6431540A - Setting agent composition for mold - Google Patents
Setting agent composition for moldInfo
- Publication number
- JPS6431540A JPS6431540A JP18474287A JP18474287A JPS6431540A JP S6431540 A JPS6431540 A JP S6431540A JP 18474287 A JP18474287 A JP 18474287A JP 18474287 A JP18474287 A JP 18474287A JP S6431540 A JPS6431540 A JP S6431540A
- Authority
- JP
- Japan
- Prior art keywords
- sulfonic acid
- setting agent
- weak basic
- salts
- fecl3
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mold Materials And Core Materials (AREA)
Abstract
PURPOSE:To shorten setting time and to improve characteristic of a mold by containing FeCl3 or CuCl2 in the setting agent composing of salts of weak basic and low class aliphatic sulfonic acid or aromatic acid. CONSTITUTION:To 100wt. parts of refractory granular aggregate, 0.5-5 parts of acid setting resin and 0.1-3 parts of setting agent composition are mixed. The setting agent is constituted by composition of the salts of the weak basic and the low class aliphatic sulfonic acid or the aromatic sulfonic acid, and FeCl3 or CaCl2. The salts of the weak basic and the sulfonic acid use at least one kind of benzene sulfonic acid, phenol sulfonic acid, toluene sulfonic acid, etc., and at least one kind of salt of A, Cu, Zn, Fe (for example, copper toluene sulfonic acid). It is desirable that wt. ratio of the weak basic and salt of the sulfonic acid (A) and FeCl3 or CuCl2 (B) comes to in the range of A/B=1/9-6/4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18474287A JPS6431540A (en) | 1987-07-24 | 1987-07-24 | Setting agent composition for mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18474287A JPS6431540A (en) | 1987-07-24 | 1987-07-24 | Setting agent composition for mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6431540A true JPS6431540A (en) | 1989-02-01 |
JPH0573495B2 JPH0573495B2 (en) | 1993-10-14 |
Family
ID=16158555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18474287A Granted JPS6431540A (en) | 1987-07-24 | 1987-07-24 | Setting agent composition for mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431540A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0352743A (en) * | 1989-07-21 | 1991-03-06 | Kao Corp | Composition for mold |
-
1987
- 1987-07-24 JP JP18474287A patent/JPS6431540A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0352743A (en) * | 1989-07-21 | 1991-03-06 | Kao Corp | Composition for mold |
Also Published As
Publication number | Publication date |
---|---|
JPH0573495B2 (en) | 1993-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |