JPS6431432A - Releasing method for chips - Google Patents
Releasing method for chipsInfo
- Publication number
- JPS6431432A JPS6431432A JP62188161A JP18816187A JPS6431432A JP S6431432 A JPS6431432 A JP S6431432A JP 62188161 A JP62188161 A JP 62188161A JP 18816187 A JP18816187 A JP 18816187A JP S6431432 A JPS6431432 A JP S6431432A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- tape
- slider
- elevational
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To prevent a chip from being obliquely attracted or an attracting position from displacing by heating the rear face of a position directly under a pickup nozzle of an adhesive tape. CONSTITUTION:A chip releasing device has an elevational slider 9 for sliding a heating rod 8 heated by a heater 7 in elevational directions in a casing 4, and an elevational driver 10 for driving the slider 9, and when an adhesive tape 1 moves horizontally to dispose a chip 2 at a predetermined position, a pickup nozzle 3 is moved downward to retain the chip 2. Then, a heating rod 8 heated by a heater 7 is slid upward by the slider 9. the rear face to which the chip 2 of the tape 1 is bonded is heated until the adhesive force of the tape 1 is weakened. When the nozzle 3 is moved upward after the heating is completed, the chip 2 is isolated from the tape 1. Accordingly, the chip is not obliquely attracted, or the attracted position is not displaced, thereby picking up the chip in a stable attitude.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62188161A JPS6431432A (en) | 1987-07-27 | 1987-07-27 | Releasing method for chips |
EP19880115090 EP0308809A3 (en) | 1987-07-27 | 1988-09-15 | Machinable stock and machined shaped article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62188161A JPS6431432A (en) | 1987-07-27 | 1987-07-27 | Releasing method for chips |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6431432A true JPS6431432A (en) | 1989-02-01 |
Family
ID=16218821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62188161A Pending JPS6431432A (en) | 1987-07-27 | 1987-07-27 | Releasing method for chips |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431432A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS592340A (en) * | 1982-06-29 | 1984-01-07 | Fujitsu Ltd | Chip handling method |
JPS6022331A (en) * | 1983-07-19 | 1985-02-04 | Nec Corp | Selection of semiconductor pellet |
JPS622633A (en) * | 1985-06-28 | 1987-01-08 | Toshiba Corp | Stripping method for semiconductor chip and its equipment |
JPS6216542A (en) * | 1985-07-15 | 1987-01-24 | Matsushita Electronics Corp | Separating device for semiconductor chip |
-
1987
- 1987-07-27 JP JP62188161A patent/JPS6431432A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS592340A (en) * | 1982-06-29 | 1984-01-07 | Fujitsu Ltd | Chip handling method |
JPS6022331A (en) * | 1983-07-19 | 1985-02-04 | Nec Corp | Selection of semiconductor pellet |
JPS622633A (en) * | 1985-06-28 | 1987-01-08 | Toshiba Corp | Stripping method for semiconductor chip and its equipment |
JPS6216542A (en) * | 1985-07-15 | 1987-01-24 | Matsushita Electronics Corp | Separating device for semiconductor chip |
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