JPS6431432A - Releasing method for chips - Google Patents

Releasing method for chips

Info

Publication number
JPS6431432A
JPS6431432A JP62188161A JP18816187A JPS6431432A JP S6431432 A JPS6431432 A JP S6431432A JP 62188161 A JP62188161 A JP 62188161A JP 18816187 A JP18816187 A JP 18816187A JP S6431432 A JPS6431432 A JP S6431432A
Authority
JP
Japan
Prior art keywords
chip
tape
slider
elevational
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62188161A
Other languages
Japanese (ja)
Inventor
Katsumasa Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62188161A priority Critical patent/JPS6431432A/en
Priority to EP19880115090 priority patent/EP0308809A3/en
Publication of JPS6431432A publication Critical patent/JPS6431432A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To prevent a chip from being obliquely attracted or an attracting position from displacing by heating the rear face of a position directly under a pickup nozzle of an adhesive tape. CONSTITUTION:A chip releasing device has an elevational slider 9 for sliding a heating rod 8 heated by a heater 7 in elevational directions in a casing 4, and an elevational driver 10 for driving the slider 9, and when an adhesive tape 1 moves horizontally to dispose a chip 2 at a predetermined position, a pickup nozzle 3 is moved downward to retain the chip 2. Then, a heating rod 8 heated by a heater 7 is slid upward by the slider 9. the rear face to which the chip 2 of the tape 1 is bonded is heated until the adhesive force of the tape 1 is weakened. When the nozzle 3 is moved upward after the heating is completed, the chip 2 is isolated from the tape 1. Accordingly, the chip is not obliquely attracted, or the attracted position is not displaced, thereby picking up the chip in a stable attitude.
JP62188161A 1987-07-27 1987-07-27 Releasing method for chips Pending JPS6431432A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62188161A JPS6431432A (en) 1987-07-27 1987-07-27 Releasing method for chips
EP19880115090 EP0308809A3 (en) 1987-07-27 1988-09-15 Machinable stock and machined shaped article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62188161A JPS6431432A (en) 1987-07-27 1987-07-27 Releasing method for chips

Publications (1)

Publication Number Publication Date
JPS6431432A true JPS6431432A (en) 1989-02-01

Family

ID=16218821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62188161A Pending JPS6431432A (en) 1987-07-27 1987-07-27 Releasing method for chips

Country Status (1)

Country Link
JP (1) JPS6431432A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592340A (en) * 1982-06-29 1984-01-07 Fujitsu Ltd Chip handling method
JPS6022331A (en) * 1983-07-19 1985-02-04 Nec Corp Selection of semiconductor pellet
JPS622633A (en) * 1985-06-28 1987-01-08 Toshiba Corp Stripping method for semiconductor chip and its equipment
JPS6216542A (en) * 1985-07-15 1987-01-24 Matsushita Electronics Corp Separating device for semiconductor chip

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592340A (en) * 1982-06-29 1984-01-07 Fujitsu Ltd Chip handling method
JPS6022331A (en) * 1983-07-19 1985-02-04 Nec Corp Selection of semiconductor pellet
JPS622633A (en) * 1985-06-28 1987-01-08 Toshiba Corp Stripping method for semiconductor chip and its equipment
JPS6216542A (en) * 1985-07-15 1987-01-24 Matsushita Electronics Corp Separating device for semiconductor chip

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