JPS6430853U - - Google Patents
Info
- Publication number
- JPS6430853U JPS6430853U JP12574787U JP12574787U JPS6430853U JP S6430853 U JPS6430853 U JP S6430853U JP 12574787 U JP12574787 U JP 12574787U JP 12574787 U JP12574787 U JP 12574787U JP S6430853 U JPS6430853 U JP S6430853U
- Authority
- JP
- Japan
- Prior art keywords
- out terminal
- terminal pin
- lead
- metallized pad
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図イは本考案による引出端子ピンの取付構
造の実施例を示す断面図、第１図ロは他の実施例
における引出端子ピンの断面図、第２図は半導体
パツケージの断面図、第３図は従来の引出端子ピ
ンの取付構造を示す断面図、第４図は引出端子ピ
ンの底面とメタライズパツトとの間の間隙と引張
強度との関係を示すグラフである。
１―１：メタライズパツト、２：セラミツク基
体、４：引出端子ピン、４―３：引出端子ピンの
底面、４―４：凸部。
FIG. 1A is a cross-sectional view showing an embodiment of the mounting structure for a lead-out terminal pin according to the present invention, FIG. 1B is a cross-sectional view of a lead-out terminal pin in another embodiment, FIG. FIG. 3 is a cross-sectional view showing a conventional mounting structure for a lead-out terminal pin, and FIG. 4 is a graph showing the relationship between the gap between the bottom surface of the lead-out terminal pin and the metallized pad and the tensile strength. 1-1: metallized part, 2: ceramic base, 4: lead-out terminal pin, 4-3: bottom surface of lead-out terminal pin, 4-4: convex portion.
Claims (1)
ツク基体の表面に形成されたメタライズパツトへ
の引出端子ピンの取付構造において、引出端子ピ
ンの底面に凸部が設けられ、該凸部をメタライズ
パツトに当接させたとき、引出端子ピンの底面と
メタライズパツトとの間隙が２０〜５０μｍに形
成されてろう接されてなることを特徴とする引出
端子ピンの取付構造。 In a structure for attaching a pull-out terminal pin to a metallized pad formed on the surface of a ceramic base of a plug-in type ceramic semiconductor container, a convex portion is provided on the bottom surface of the pull-out terminal pin, and the convex portion is brought into contact with the metallized pad. A mounting structure for a lead-out terminal pin, characterized in that the bottom surface of the lead-out terminal pin and the metallized pad are brazed together with a gap of 20 to 50 μm formed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12574787U JPS6430853U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12574787U JPS6430853U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430853U true JPS6430853U (en) | 1989-02-27 |
Family
ID=31376628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12574787U Pending JPS6430853U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430853U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7723620B2 (en) | 2004-09-15 | 2010-05-25 | Ibiden Co., Ltd. | Lead pin for mounting semiconductor and printed wiring board |
| JP2010141298A (en) * | 2009-10-26 | 2010-06-24 | Shinko Electric Ind Co Ltd | Wiring board having lead pin, and lead pin |
| US8379402B2 (en) | 2008-12-10 | 2013-02-19 | Shinko Electric Industries Co., Ltd. | Wiring board having lead pin, and lead pin |
-
1987
- 1987-08-20 JP JP12574787U patent/JPS6430853U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7723620B2 (en) | 2004-09-15 | 2010-05-25 | Ibiden Co., Ltd. | Lead pin for mounting semiconductor and printed wiring board |
| US8379402B2 (en) | 2008-12-10 | 2013-02-19 | Shinko Electric Industries Co., Ltd. | Wiring board having lead pin, and lead pin |
| JP2010141298A (en) * | 2009-10-26 | 2010-06-24 | Shinko Electric Ind Co Ltd | Wiring board having lead pin, and lead pin |
| JP4606504B2 (en) * | 2009-10-26 | 2011-01-05 | 新光電気工業株式会社 | Wiring board with lead pins and lead pins |
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