JPS6430833U - - Google Patents
Info
- Publication number
- JPS6430833U JPS6430833U JP12674387U JP12674387U JPS6430833U JP S6430833 U JPS6430833 U JP S6430833U JP 12674387 U JP12674387 U JP 12674387U JP 12674387 U JP12674387 U JP 12674387U JP S6430833 U JPS6430833 U JP S6430833U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavities
- plunger
- mold
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案の一実施例のポツト部を示すも
ので、第１図ａはポツト部の断面図、第１図ｂは
プランジヤリングの側面図である。第２図は量産
用金型の従来例の構成図であり、第３図は第２図
の金型のポツト部の断面図である。
１……ポツト、３……ランナ、４……プランジ
ヤ、５……樹脂、４１……プランジヤリング、４
２……溝。
FIG. 1 shows a pot portion of an embodiment of the present invention, FIG. 1a is a sectional view of the pot portion, and FIG. 1b is a side view of the plunger ring. FIG. 2 is a block diagram of a conventional example of a mold for mass production, and FIG. 3 is a sectional view of a pot portion of the mold shown in FIG. 1...Pot, 3...Runner, 4...Plunger, 5...Resin, 41...Plunger ring, 4
2...Groove.
Claims (1)
収容されポツトからランナを介して前記キヤビテ
イに樹脂が圧送充填され封止成型されるものにお
いて、キヤビテイへ樹脂が送られるようにポツト
内の樹脂に圧力を加えるプランジヤのプランジヤ
リングのポツト内面に対向する面にプランジヤの
移動方向に対して直角方向の溝を設けたことを特
徴とする半導体素子樹脂封止用成型金型。 In molds in which semiconductor chips are housed in cavities of a mold and resin is pressure-filled into the cavities from pots via runners and sealed, pressure is applied to the resin in the pots so that the resin is sent to the cavities. 1. A mold for resin-sealing a semiconductor element, characterized in that a groove is provided in a surface of a plunger opposite to the inner surface of a pot of a plunger ring in a direction perpendicular to the moving direction of the plunger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12674387U JPS6430833U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12674387U JPS6430833U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430833U true JPS6430833U (en) | 1989-02-27 |
Family
ID=31378533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12674387U Pending JPS6430833U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430833U (en) |
-
1987
- 1987-08-20 JP JP12674387U patent/JPS6430833U/ja active Pending
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