JPS6429829U - - Google Patents
Info
- Publication number
- JPS6429829U JPS6429829U JP12493187U JP12493187U JPS6429829U JP S6429829 U JPS6429829 U JP S6429829U JP 12493187 U JP12493187 U JP 12493187U JP 12493187 U JP12493187 U JP 12493187U JP S6429829 U JPS6429829 U JP S6429829U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heater block
- burr
- groove
- sinks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12493187U JPH0526744Y2 (https=) | 1987-08-17 | 1987-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12493187U JPH0526744Y2 (https=) | 1987-08-17 | 1987-08-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6429829U true JPS6429829U (https=) | 1989-02-22 |
| JPH0526744Y2 JPH0526744Y2 (https=) | 1993-07-07 |
Family
ID=31375086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12493187U Expired - Lifetime JPH0526744Y2 (https=) | 1987-08-17 | 1987-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526744Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7409175B2 (en) | 2005-02-07 | 2008-08-05 | Samsung Electronics Co., Ltd. | Image forming apparatus and image reading apparatus with locking unit for locking movable object |
| JP2014120544A (ja) * | 2012-12-14 | 2014-06-30 | Mitsubishi Electric Corp | 発光装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6282956B1 (en) | 1994-12-29 | 2001-09-04 | Kazuhiro Okada | Multi-axial angular velocity sensor |
-
1987
- 1987-08-17 JP JP12493187U patent/JPH0526744Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7409175B2 (en) | 2005-02-07 | 2008-08-05 | Samsung Electronics Co., Ltd. | Image forming apparatus and image reading apparatus with locking unit for locking movable object |
| JP2014120544A (ja) * | 2012-12-14 | 2014-06-30 | Mitsubishi Electric Corp | 発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526744Y2 (https=) | 1993-07-07 |