JPS6429829U - - Google Patents

Info

Publication number
JPS6429829U
JPS6429829U JP12493187U JP12493187U JPS6429829U JP S6429829 U JPS6429829 U JP S6429829U JP 12493187 U JP12493187 U JP 12493187U JP 12493187 U JP12493187 U JP 12493187U JP S6429829 U JPS6429829 U JP S6429829U
Authority
JP
Japan
Prior art keywords
lead frame
heater block
burr
groove
sinks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12493187U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526744Y2 (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12493187U priority Critical patent/JPH0526744Y2/ja
Publication of JPS6429829U publication Critical patent/JPS6429829U/ja
Application granted granted Critical
Publication of JPH0526744Y2 publication Critical patent/JPH0526744Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP12493187U 1987-08-17 1987-08-17 Expired - Lifetime JPH0526744Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12493187U JPH0526744Y2 (enFirst) 1987-08-17 1987-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12493187U JPH0526744Y2 (enFirst) 1987-08-17 1987-08-17

Publications (2)

Publication Number Publication Date
JPS6429829U true JPS6429829U (enFirst) 1989-02-22
JPH0526744Y2 JPH0526744Y2 (enFirst) 1993-07-07

Family

ID=31375086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12493187U Expired - Lifetime JPH0526744Y2 (enFirst) 1987-08-17 1987-08-17

Country Status (1)

Country Link
JP (1) JPH0526744Y2 (enFirst)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7409175B2 (en) 2005-02-07 2008-08-05 Samsung Electronics Co., Ltd. Image forming apparatus and image reading apparatus with locking unit for locking movable object
JP2014120544A (ja) * 2012-12-14 2014-06-30 Mitsubishi Electric Corp 発光装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282956B1 (en) 1994-12-29 2001-09-04 Kazuhiro Okada Multi-axial angular velocity sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7409175B2 (en) 2005-02-07 2008-08-05 Samsung Electronics Co., Ltd. Image forming apparatus and image reading apparatus with locking unit for locking movable object
JP2014120544A (ja) * 2012-12-14 2014-06-30 Mitsubishi Electric Corp 発光装置

Also Published As

Publication number Publication date
JPH0526744Y2 (enFirst) 1993-07-07

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