JPS6429827U - - Google Patents

Info

Publication number
JPS6429827U
JPS6429827U JP12368687U JP12368687U JPS6429827U JP S6429827 U JPS6429827 U JP S6429827U JP 12368687 U JP12368687 U JP 12368687U JP 12368687 U JP12368687 U JP 12368687U JP S6429827 U JPS6429827 U JP S6429827U
Authority
JP
Japan
Prior art keywords
leads
die pad
semiconductor element
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12368687U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12368687U priority Critical patent/JPS6429827U/ja
Publication of JPS6429827U publication Critical patent/JPS6429827U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12368687U 1987-08-12 1987-08-12 Pending JPS6429827U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12368687U JPS6429827U (ko) 1987-08-12 1987-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12368687U JPS6429827U (ko) 1987-08-12 1987-08-12

Publications (1)

Publication Number Publication Date
JPS6429827U true JPS6429827U (ko) 1989-02-22

Family

ID=31372764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12368687U Pending JPS6429827U (ko) 1987-08-12 1987-08-12

Country Status (1)

Country Link
JP (1) JPS6429827U (ko)

Similar Documents

Publication Publication Date Title
JPS6429827U (ko)
JPS63193836U (ko)
JPS6294632U (ko)
JPS6241676U (ko)
JPS62163966U (ko)
JPS63200355U (ko)
JPH01104721U (ko)
JPS6276535U (ko)
JPH0313754U (ko)
JPS6282734U (ko)
JPS63200340U (ko)
JPS58170846U (ja) 半導体装置用リ−ドフレ−ム
JPS63180928U (ko)
JPS6444647U (ko)
JPS6361161U (ko)
JPS63201346U (ko)
JPH0289835U (ko)
JPS63121456U (ko)
JPH0330437U (ko)
JPH0348230U (ko)
JPS63132441U (ko)
JPH0316337U (ko)
JPS6240842U (ko)
JPS63172138U (ko)
JPS63167749U (ko)