JPS6424838U - - Google Patents
Info
- Publication number
- JPS6424838U JPS6424838U JP1987118406U JP11840687U JPS6424838U JP S6424838 U JPS6424838 U JP S6424838U JP 1987118406 U JP1987118406 U JP 1987118406U JP 11840687 U JP11840687 U JP 11840687U JP S6424838 U JPS6424838 U JP S6424838U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lead portion
- chip
- circuit board
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/075—
-
- H10W72/015—
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- H10W72/01515—
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- H10W72/5445—
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- H10W74/00—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118406U JPS6424838U (enExample) | 1987-07-31 | 1987-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118406U JPS6424838U (enExample) | 1987-07-31 | 1987-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424838U true JPS6424838U (enExample) | 1989-02-10 |
Family
ID=31362738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987118406U Pending JPS6424838U (enExample) | 1987-07-31 | 1987-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424838U (enExample) |
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1987
- 1987-07-31 JP JP1987118406U patent/JPS6424838U/ja active Pending