JPS6296848U - - Google Patents
Info
- Publication number
- JPS6296848U JPS6296848U JP1985189347U JP18934785U JPS6296848U JP S6296848 U JPS6296848 U JP S6296848U JP 1985189347 U JP1985189347 U JP 1985189347U JP 18934785 U JP18934785 U JP 18934785U JP S6296848 U JPS6296848 U JP S6296848U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- die bonding
- integrated circuit
- hybrid integrated
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
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- H10W70/681—
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- H10W72/073—
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- H10W72/075—
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- H10W72/884—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189347U JPS6296848U (enExample) | 1985-12-09 | 1985-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985189347U JPS6296848U (enExample) | 1985-12-09 | 1985-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296848U true JPS6296848U (enExample) | 1987-06-20 |
Family
ID=31141562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985189347U Pending JPS6296848U (enExample) | 1985-12-09 | 1985-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296848U (enExample) |
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1985
- 1985-12-09 JP JP1985189347U patent/JPS6296848U/ja active Pending