JPS6424836U - - Google Patents
Info
- Publication number
- JPS6424836U JPS6424836U JP12054087U JP12054087U JPS6424836U JP S6424836 U JPS6424836 U JP S6424836U JP 12054087 U JP12054087 U JP 12054087U JP 12054087 U JP12054087 U JP 12054087U JP S6424836 U JPS6424836 U JP S6424836U
- Authority
- JP
- Japan
- Prior art keywords
- block
- insertion hole
- spacer block
- spacer
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987120540U JPH08757Y2 (ja) | 1987-08-05 | 1987-08-05 | 半導体装置の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987120540U JPH08757Y2 (ja) | 1987-08-05 | 1987-08-05 | 半導体装置の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6424836U true JPS6424836U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-02-10 |
| JPH08757Y2 JPH08757Y2 (ja) | 1996-01-10 |
Family
ID=31366740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987120540U Expired - Lifetime JPH08757Y2 (ja) | 1987-08-05 | 1987-08-05 | 半導体装置の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08757Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008307738A (ja) * | 2007-06-13 | 2008-12-25 | Sumitomo Heavy Ind Ltd | 圧縮成形金型及び圧縮成形金型装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226827A (ja) * | 1985-07-27 | 1987-02-04 | Mitsubishi Electric Corp | 半導体素子の樹脂封止方法及びその装置 |
-
1987
- 1987-08-05 JP JP1987120540U patent/JPH08757Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6226827A (ja) * | 1985-07-27 | 1987-02-04 | Mitsubishi Electric Corp | 半導体素子の樹脂封止方法及びその装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008307738A (ja) * | 2007-06-13 | 2008-12-25 | Sumitomo Heavy Ind Ltd | 圧縮成形金型及び圧縮成形金型装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08757Y2 (ja) | 1996-01-10 |