JPS642469U - - Google Patents
Info
- Publication number
- JPS642469U JPS642469U JP9627987U JP9627987U JPS642469U JP S642469 U JPS642469 U JP S642469U JP 9627987 U JP9627987 U JP 9627987U JP 9627987 U JP9627987 U JP 9627987U JP S642469 U JPS642469 U JP S642469U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lsi
- package type
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9627987U JPS642469U (cs) | 1987-06-22 | 1987-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9627987U JPS642469U (cs) | 1987-06-22 | 1987-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS642469U true JPS642469U (cs) | 1989-01-09 |
Family
ID=31321146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9627987U Pending JPS642469U (cs) | 1987-06-22 | 1987-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS642469U (cs) |
-
1987
- 1987-06-22 JP JP9627987U patent/JPS642469U/ja active Pending