JPH0254247U - - Google Patents
Info
- Publication number
- JPH0254247U JPH0254247U JP13369388U JP13369388U JPH0254247U JP H0254247 U JPH0254247 U JP H0254247U JP 13369388 U JP13369388 U JP 13369388U JP 13369388 U JP13369388 U JP 13369388U JP H0254247 U JPH0254247 U JP H0254247U
- Authority
- JP
- Japan
- Prior art keywords
- pins
- package
- lsi package
- coarser
- featuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13369388U JPH0254247U (cs) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13369388U JPH0254247U (cs) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254247U true JPH0254247U (cs) | 1990-04-19 |
Family
ID=31391793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13369388U Pending JPH0254247U (cs) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254247U (cs) |
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1988
- 1988-10-13 JP JP13369388U patent/JPH0254247U/ja active Pending