JPS6421379U - - Google Patents
Info
- Publication number
- JPS6421379U JPS6421379U JP11450287U JP11450287U JPS6421379U JP S6421379 U JPS6421379 U JP S6421379U JP 11450287 U JP11450287 U JP 11450287U JP 11450287 U JP11450287 U JP 11450287U JP S6421379 U JPS6421379 U JP S6421379U
- Authority
- JP
- Japan
- Prior art keywords
- stand
- imphal
- supported
- wafer
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000523 sample Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図はこの考案の半導体集積回路の測定装置
の一実施例の正面図、第２図は同上実施例の台の
熱膨張によるプローブ針のずれの計算に適用する
ための図、第３図は同上実施例におけるプローブ
針とプローブ固定用アームとの配置関係を示す図
、第４図は従来の半導体集積回路の測定装置の正
面図、第５図は従来の半導体集積回路の測定装置
の素子とアルミパツトおよびプローブ針の配置関
係を示す図である。
１１……脚、１２，２１……台、２３……ウエ
ハ、２４……ヒータ線、２５……冷却パイプ、５
１……プローブ針、５２……プローブ固定用アー
ム。
Fig. 1 is a front view of one embodiment of the semiconductor integrated circuit measuring device of this invention, Fig. 2 is a diagram applied to calculation of the deviation of the probe needle due to thermal expansion of the stand of the same embodiment, and Fig. 3. 4 is a front view of a conventional semiconductor integrated circuit measuring device, and FIG. 5 is a diagram showing the elements of a conventional semiconductor integrated circuit measuring device. FIG. 3 is a diagram showing the arrangement relationship between aluminum pads and probe needles. 11... Legs, 12, 21... Stand, 23... Wafer, 24... Heater wire, 25... Cooling pipe, 5
1... Probe needle, 52... Probe fixing arm.
Claims (1)
線を有する第１の台と、 (b) この第１の台の熱膨張時の長さより長くか
つインパールで形成された複数の脚と、 (c) この脚の上端面に支持され上面に上記ウエ
ハを載置するとともに下面に上記第１の台の上面
を密着させてこの第１の台を吊り下げるように支
持するインパールで形成された第２の台と、 よりなる半導体集積回路の測定装置。[Claims for Utility Model Registration] (a) A first stand having at least a heater wire for heating the wafer; (b) A length longer than the length of the first stand during thermal expansion and formed of Imphal. (c) supported by the upper end surfaces of the legs, with the wafer placed on the upper surface, and with the upper surface of the first table in close contact with the lower surface, the first table is supported so as to be suspended; A semiconductor integrated circuit measuring device consisting of a second stand made of Imphal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11450287U JPS6421379U (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11450287U JPS6421379U (en) | 1987-07-28 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6421379U true JPS6421379U (en) | 1989-02-02 |
Family
ID=31355311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11450287U Pending JPS6421379U (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6421379U (en) |
-
1987
- 1987-07-28 JP JP11450287U patent/JPS6421379U/ja active Pending
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