JPS6420834U - - Google Patents
Info
- Publication number
- JPS6420834U JPS6420834U JP11495987U JP11495987U JPS6420834U JP S6420834 U JPS6420834 U JP S6420834U JP 11495987 U JP11495987 U JP 11495987U JP 11495987 U JP11495987 U JP 11495987U JP S6420834 U JPS6420834 U JP S6420834U
- Authority
- JP
- Japan
- Prior art keywords
- piezo element
- vibration device
- support member
- rigid body
- oscillation circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000010355 oscillation Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Percussion Or Vibration Massage (AREA)
- Finger-Pressure Massage (AREA)
Description
第１図は、本考案の一実施例である振動装置の
概略構成図、第２図は、本考案の一実施例である
振動装置の平面図、第３図は、第２図の背面図、
第４図及び第５図は、本実施例の組立工程を説明
するための図、第６図は、本実施例に適用可能な
発振回路の一例の回路構成図、第７図は、本考案
の振動装置に適用可能な他の一例を示す支持部材
の形状の説明図である。
１……振動装置、２……振動体、３……片面粘
着テープ、４……オンスイツチ、５……オフスイ
ツチ、６……ピエゾ素子、７……支持部材、８…
…金属製半球、９……リチウム電池、１０……フ
レキシブル基板、１１……回路部、１２……導電
ゴム、１３，１４……孔、１５……導電部、１６
……ハンダ、１７……薄板、１８……発振回路、
２１……スイツチング部、２２……増幅部、２３
……発振部、２４……ＲＳフリツプフロツプ、２
５……ナンドゲート、２６……ＰＮＰ型トランジ
スタ、２７……ナンドゲート、Ａ……アース接点
。
Fig. 1 is a schematic configuration diagram of a vibrating device which is an embodiment of the present invention, Fig. 2 is a plan view of the vibrating device which is an embodiment of the present invention, and Fig. 3 is a rear view of Fig. 2. ,
4 and 5 are diagrams for explaining the assembly process of this embodiment, FIG. 6 is a circuit configuration diagram of an example of an oscillation circuit applicable to this embodiment, and FIG. 7 is a diagram for explaining the assembly process of this embodiment. FIG. 3 is an explanatory diagram of the shape of a support member showing another example applicable to the vibration device of FIG. DESCRIPTION OF SYMBOLS 1... Vibration device, 2... Vibrating body, 3... Single-sided adhesive tape, 4... On switch, 5... Off switch, 6... Piezo element, 7... Support member, 8...
... Metal hemisphere, 9 ... Lithium battery, 10 ... Flexible board, 11 ... Circuit section, 12 ... Conductive rubber, 13, 14 ... Hole, 15 ... Conductive part, 16
... Solder, 17 ... Thin plate, 18 ... Oscillator circuit,
21... Switching section, 22... Amplifying section, 23
...Oscillator, 24...RS flip-flop, 2
5... NAND gate, 26... PNP transistor, 27... NAND gate, A... Earth contact.
Claims (1)
ル基板の裏面側と前記ピエゾ素子を振動させる発
振回路を配設したフレキシブル基板の裏面側とを
互いに対向させるように配置させ、前記裏面間に
前記発振回路の電源を介装し、前記ピエゾ素子と
前記発振回路及び前記電源の電気的接続を前記フ
レキシブル基板上のパターン配線と前記ピエゾ素
子及び前記電源の電極を直接ボンデイングするこ
とで行い、前記ピエゾ素子表面の少なくとも一部
に剛体を配設し、前記ピエゾ素子表面に配設され
た前記剛体以外の部分に支持部材を配設した振動
装置において、該振動装置は前記ピエゾ素子と前
記剛体及び前記支持部材を裏面にして固着するこ
とのできる取付構造を有することを特徴とする振
動装置。 (2) 前記取付構造は、片面粘着テープであるこ
とを特徴とする実用新案登録請求の範囲第１項記
載の振動装置。 (3) 前記剛体は、金属製の凸部を有する部材で
あることを特徴とする実用新案登録請求の範囲第
１項または第２項記載の振動装置。 (4) 前記支持部材は、リング型形状ゴムである
ことを特徴とする実用新案登録請求の範囲第１項
乃至第３項のいずれかに記載の振動装置。 (5) 前記支持部材は、複数から成る突起型形状
ゴムであることを特徴とする実用新案登録請求の
範囲第１項乃至第３項のいずれかに記載の振動装
置。[Claims for Utility Model Registration] (1) The back side of a flexible substrate on which a flat piezo element is arranged and the back side of a flexible board on which an oscillation circuit for vibrating the piezo element is arranged are opposed to each other. A power supply for the oscillation circuit is interposed between the back surfaces, and electrical connections between the piezo element, the oscillation circuit, and the power supply are made by directly connecting the pattern wiring on the flexible substrate and the electrodes of the piezo element and the power supply. In a vibration device in which a rigid body is disposed on at least a part of the surface of the piezo element, and a support member is disposed on a portion other than the rigid body disposed on the surface of the piezo element, the vibration device A vibration device characterized by having a mounting structure that allows the piezo element, the rigid body, and the support member to be fixed with their back faces facing each other. (2) The vibrating device according to claim 1, wherein the mounting structure is a single-sided adhesive tape. (3) The vibration device according to claim 1 or 2, wherein the rigid body is a member having a metal protrusion. (4) The vibration device according to any one of claims 1 to 3, wherein the support member is a ring-shaped rubber. (5) The vibrating device according to any one of claims 1 to 3, wherein the support member is a plurality of rubber protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987114959U JPH0420437Y2 (en) | 1987-07-25 | 1987-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987114959U JPH0420437Y2 (en) | 1987-07-25 | 1987-07-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420834U true JPS6420834U (en) | 1989-02-01 |
| JPH0420437Y2 JPH0420437Y2 (en) | 1992-05-11 |
Family
ID=31356179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987114959U Expired JPH0420437Y2 (en) | 1987-07-25 | 1987-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420437Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018064730A (en) * | 2016-10-18 | 2018-04-26 | 伊藤超短波株式会社 | Electrode |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62152456A (en) * | 1985-12-26 | 1987-07-07 | アロカ株式会社 | Ultrasonic stimulating probe |
-
1987
- 1987-07-25 JP JP1987114959U patent/JPH0420437Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62152456A (en) * | 1985-12-26 | 1987-07-07 | アロカ株式会社 | Ultrasonic stimulating probe |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018064730A (en) * | 2016-10-18 | 2018-04-26 | 伊藤超短波株式会社 | Electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0420437Y2 (en) | 1992-05-11 |
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