JPS6420734U - - Google Patents

Info

Publication number
JPS6420734U
JPS6420734U JP11576687U JP11576687U JPS6420734U JP S6420734 U JPS6420734 U JP S6420734U JP 11576687 U JP11576687 U JP 11576687U JP 11576687 U JP11576687 U JP 11576687U JP S6420734 U JPS6420734 U JP S6420734U
Authority
JP
Japan
Prior art keywords
peeling
semiconductor pellet
adhesive sheet
take
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11576687U
Other languages
English (en)
Other versions
JPH066510Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987115766U priority Critical patent/JPH066510Y2/ja
Publication of JPS6420734U publication Critical patent/JPS6420734U/ja
Application granted granted Critical
Publication of JPH066510Y2 publication Critical patent/JPH066510Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の一実施例としての半導体ペレ
ツトの剥離装置の側面図、第２図は粘着シートか
ら半導体ペレツトが剥離される状態の断面図であ
る。第３図は従来例の半導体ペレツトの剥離装置
の断面図、第４図は前記剥離装置による半導体ペ
レツトの剥離状態を示す断面図である。 １……コレツト、２……吸着部、３……加熱装
置、Ａ……半導体ペレツト、Ｂ……粘着シート。

Claims (1)

  1. 【実用新案登録請求の範囲】 粘着シート上で個々に分割された半導体ペレツ
    トを剥離して取り出す装置において、 取り出し位置の粘着層を急加熱する手段を設け
    たことを特徴とする半導体ペレツトの剥離装置。
JP1987115766U 1987-07-27 1987-07-27 半導体ペレットの剥離装置 Expired - Lifetime JPH066510Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987115766U JPH066510Y2 (ja) 1987-07-27 1987-07-27 半導体ペレットの剥離装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987115766U JPH066510Y2 (ja) 1987-07-27 1987-07-27 半導体ペレットの剥離装置

Publications (2)

Publication Number Publication Date
JPS6420734U true JPS6420734U (ja) 1989-02-01
JPH066510Y2 JPH066510Y2 (ja) 1994-02-16

Family

ID=31357711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987115766U Expired - Lifetime JPH066510Y2 (ja) 1987-07-27 1987-07-27 半導体ペレットの剥離装置

Country Status (1)

Country Link
JP (1) JPH066510Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076096A (ja) * 2000-08-29 2002-03-15 Disco Abrasive Syst Ltd 半導体素子のピックアップ方法
JP2015119085A (ja) * 2013-12-19 2015-06-25 株式会社ディスコ デバイスウェーハの加工方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191532A (ja) * 2003-11-12 2005-07-14 Sekisui Chem Co Ltd 半導体チップの製造方法
JP4674070B2 (ja) * 2003-11-12 2011-04-20 積水化学工業株式会社 半導体チップの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135280A (en) * 1977-04-30 1978-11-25 Mitsubishi Electric Corp Exfoliating unit of semiconductor chip
JPS5444679U (ja) * 1977-09-02 1979-03-27

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444679B2 (ja) * 1972-04-07 1979-12-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135280A (en) * 1977-04-30 1978-11-25 Mitsubishi Electric Corp Exfoliating unit of semiconductor chip
JPS5444679U (ja) * 1977-09-02 1979-03-27

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076096A (ja) * 2000-08-29 2002-03-15 Disco Abrasive Syst Ltd 半導体素子のピックアップ方法
JP4546626B2 (ja) * 2000-08-29 2010-09-15 株式会社ディスコ 半導体素子のピックアップ方法
JP2015119085A (ja) * 2013-12-19 2015-06-25 株式会社ディスコ デバイスウェーハの加工方法

Also Published As

Publication number Publication date
JPH066510Y2 (ja) 1994-02-16

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