JPS6420734U - - Google Patents
Info
- Publication number
- JPS6420734U JPS6420734U JP11576687U JP11576687U JPS6420734U JP S6420734 U JPS6420734 U JP S6420734U JP 11576687 U JP11576687 U JP 11576687U JP 11576687 U JP11576687 U JP 11576687U JP S6420734 U JPS6420734 U JP S6420734U
- Authority
- JP
- Japan
- Prior art keywords
- peeling
- semiconductor pellet
- adhesive sheet
- take
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115766U JPH066510Y2 (ja) | 1987-07-27 | 1987-07-27 | 半導体ペレットの剥離装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115766U JPH066510Y2 (ja) | 1987-07-27 | 1987-07-27 | 半導体ペレットの剥離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420734U true JPS6420734U (US20030157376A1-20030821-M00001.png) | 1989-02-01 |
| JPH066510Y2 JPH066510Y2 (ja) | 1994-02-16 |
Family
ID=31357711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987115766U Expired - Lifetime JPH066510Y2 (ja) | 1987-07-27 | 1987-07-27 | 半導体ペレットの剥離装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066510Y2 (US20030157376A1-20030821-M00001.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076096A (ja) * | 2000-08-29 | 2002-03-15 | Disco Abrasive Syst Ltd | 半導体素子のピックアップ方法 |
| JP2015119085A (ja) * | 2013-12-19 | 2015-06-25 | 株式会社ディスコ | デバイスウェーハの加工方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4674070B2 (ja) * | 2003-11-12 | 2011-04-20 | 積水化学工業株式会社 | 半導体チップの製造方法 |
| JP2005191532A (ja) * | 2003-11-12 | 2005-07-14 | Sekisui Chem Co Ltd | 半導体チップの製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135280A (en) * | 1977-04-30 | 1978-11-25 | Mitsubishi Electric Corp | Exfoliating unit of semiconductor chip |
| JPS5444679U (US20030157376A1-20030821-M00001.png) * | 1977-09-02 | 1979-03-27 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444679B2 (US20030157376A1-20030821-M00001.png) * | 1972-04-07 | 1979-12-27 |
-
1987
- 1987-07-27 JP JP1987115766U patent/JPH066510Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53135280A (en) * | 1977-04-30 | 1978-11-25 | Mitsubishi Electric Corp | Exfoliating unit of semiconductor chip |
| JPS5444679U (US20030157376A1-20030821-M00001.png) * | 1977-09-02 | 1979-03-27 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076096A (ja) * | 2000-08-29 | 2002-03-15 | Disco Abrasive Syst Ltd | 半導体素子のピックアップ方法 |
| JP4546626B2 (ja) * | 2000-08-29 | 2010-09-15 | 株式会社ディスコ | 半導体素子のピックアップ方法 |
| JP2015119085A (ja) * | 2013-12-19 | 2015-06-25 | 株式会社ディスコ | デバイスウェーハの加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066510Y2 (ja) | 1994-02-16 |
