JPS6420646A - Semiconductor device and manufacture thereof - Google Patents
Semiconductor device and manufacture thereofInfo
- Publication number
- JPS6420646A JPS6420646A JP62176189A JP17618987A JPS6420646A JP S6420646 A JPS6420646 A JP S6420646A JP 62176189 A JP62176189 A JP 62176189A JP 17618987 A JP17618987 A JP 17618987A JP S6420646 A JPS6420646 A JP S6420646A
- Authority
- JP
- Japan
- Prior art keywords
- film
- trench
- sidewall
- substrate
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To prevent an alpha-ray software error by forming a single crystalline layer containing a reverse conductivity type impurity and an oxide film layer on the sidewall of a groove or an opening formed in a first conductivity type substrate in predetermined steps. CONSTITUTION:After an oxide film 9 is formed on a P-type Si substrate 6, the film 9 is partly removed by etching. With the film 9 as a mask a trench is opened in the substrate 6. With the film 9 as a mask oxygen ions are obliquely implanted into the sidewall of the trench to form an oxide film 8 on the periphery of the sidewall. Then, a single crystal 7 is formed by annealing, B is implanted to the bottom of the trench, and an intercell isolating region 5. An N-type impurity layer (As-doping layer) 3 is formed on the sidewall. A wafer is oxidized to form a capacity insulating film 2 on the inner wall. Polysilicon is buried in the trench, P is diffused, flattened to form a plate electrode 1. Thus, electrons induced by the invasion of alpha-ray are reflected on the film 8, and information is not reversed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62176189A JPS6420646A (en) | 1987-07-15 | 1987-07-15 | Semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62176189A JPS6420646A (en) | 1987-07-15 | 1987-07-15 | Semiconductor device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6420646A true JPS6420646A (en) | 1989-01-24 |
Family
ID=16009203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62176189A Pending JPS6420646A (en) | 1987-07-15 | 1987-07-15 | Semiconductor device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6420646A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS525286A (en) * | 1975-06-30 | 1977-01-14 | Ibm | Method of producing ic device |
JPS6167955A (en) * | 1984-09-11 | 1986-04-08 | Fujitsu Ltd | Semiconductor memory device and manufacture thereof |
-
1987
- 1987-07-15 JP JP62176189A patent/JPS6420646A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS525286A (en) * | 1975-06-30 | 1977-01-14 | Ibm | Method of producing ic device |
JPS6167955A (en) * | 1984-09-11 | 1986-04-08 | Fujitsu Ltd | Semiconductor memory device and manufacture thereof |
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