JPS6420323U - - Google Patents
Info
- Publication number
- JPS6420323U JPS6420323U JP11634387U JP11634387U JPS6420323U JP S6420323 U JPS6420323 U JP S6420323U JP 11634387 U JP11634387 U JP 11634387U JP 11634387 U JP11634387 U JP 11634387U JP S6420323 U JPS6420323 U JP S6420323U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lower mold
- closing position
- position spaced
- slide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１〜４図はこの考案を具体化した一実施例を
示すものであつて、第１図は型閉状態の断面図、
第２〜４図は離型時の状態を示す断面図、第５図
は従来の金型の型閉状態の断面図、第６図は同じ
く離型時の途中段階を示す断面図である。
下型…１、第１の中型…２、スライドブロツク
…４、第２の中型…６、ばね…１２、押圧付勢機
構…１３、上型…１４、成形品…１５。
Figures 1 to 4 show an embodiment of this invention; Figure 1 is a sectional view of the mold in the closed state;
2 to 4 are cross-sectional views showing a state during mold release, FIG. 5 is a cross-sectional view of a conventional mold in a closed state, and FIG. 6 is a cross-sectional view showing an intermediate stage during mold release. Lower die...1, first middle die...2, slide block...4, second middle die...6, spring...12, pressing biasing mechanism...13, upper die...14, molded product...15.
Claims (1)
上面から離間した離型位置とに回動配置可能に配
設された第１の中型２と、 下型１の上面に摺動可能に配設されたスライド
ブロツク４と、 前記スライドブロツク４に対して、一部が前記
第１の中型２の上方に突出する状態で前記下型１
の上面に載置される型閉位置と下型１の上面から
離間した退避位置とに回動配置可能に支持された
第２の中型６と、 前記スライドブロツク４をばね１２を介して常
に型閉位置に押圧付勢する押圧付勢機構１３と、 前記両中型２，６上に載置される上型１４とを
備えた成形用金型。[Claims for Utility Model Registration] A first middle mold 2 rotatably arranged between a mold closing position loaded on the upper surface of the lower mold 1 and a mold release position spaced apart from the upper surface of the lower mold 1; a slide block 4 slidably disposed on the upper surface of the lower mold 1;
A second middle mold 6 is rotatably supported between a mold closing position placed on the upper surface and a retracted position spaced from the upper surface of the lower mold 1; A molding die comprising: a pressure biasing mechanism 13 that presses and biases to a closed position; and an upper mold 14 placed on both the intermediate molds 2 and 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11634387U JPH0442097Y2 (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11634387U JPH0442097Y2 (en) | 1987-07-28 | 1987-07-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420323U true JPS6420323U (en) | 1989-02-01 |
| JPH0442097Y2 JPH0442097Y2 (en) | 1992-10-05 |
Family
ID=31358792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11634387U Expired JPH0442097Y2 (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442097Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476414U (en) * | 1990-11-10 | 1992-07-03 | ||
| JPH05286530A (en) * | 1992-04-10 | 1993-11-02 | Kajima Corp | Heavy article transferring device |
| WO2006051844A1 (en) * | 2004-11-12 | 2006-05-18 | Matsushita Electric Industrial Co., Ltd. | Resin-sealed mold and resin-sealed device |
-
1987
- 1987-07-28 JP JP11634387U patent/JPH0442097Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476414U (en) * | 1990-11-10 | 1992-07-03 | ||
| JPH05286530A (en) * | 1992-04-10 | 1993-11-02 | Kajima Corp | Heavy article transferring device |
| WO2006051844A1 (en) * | 2004-11-12 | 2006-05-18 | Matsushita Electric Industrial Co., Ltd. | Resin-sealed mold and resin-sealed device |
| JP2006137105A (en) * | 2004-11-12 | 2006-06-01 | Matsushita Electric Ind Co Ltd | Resin-sealing mold and resin-sealing device |
| US7753667B2 (en) | 2004-11-12 | 2010-07-13 | Panasonic Corporation | Resin-sealed mold and resin-sealed device |
| JP4508839B2 (en) * | 2004-11-12 | 2010-07-21 | パナソニック株式会社 | Resin sealing mold and resin sealing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442097Y2 (en) | 1992-10-05 |