JPS6420216A - Photocurable resin composition - Google Patents

Photocurable resin composition

Info

Publication number
JPS6420216A
JPS6420216A JP17632487A JP17632487A JPS6420216A JP S6420216 A JPS6420216 A JP S6420216A JP 17632487 A JP17632487 A JP 17632487A JP 17632487 A JP17632487 A JP 17632487A JP S6420216 A JPS6420216 A JP S6420216A
Authority
JP
Japan
Prior art keywords
rubber
epoxy resin
photopolymerization initiator
component
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17632487A
Other languages
Japanese (ja)
Inventor
Hiroshi Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17632487A priority Critical patent/JPS6420216A/en
Publication of JPS6420216A publication Critical patent/JPS6420216A/en
Pending legal-status Critical Current

Links

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE:To obtain the title low-modulus composition excellent in adhesion to metals, ceramics,etc. and heat cycling resistance, by mixing a photocurable rubber-modified epoxy resin with a specified reactive compound and a photopolymerization initiator. CONSTITUTION:100pts.wt. telechelic photocurable rubber-modified epoxy resin (A) having an MW of 100-500, modified with a carboxylic acid-terminated rubber and having photo/radical-polymerizable functional groups on molecular ends, is mixed with 20-230pts.wt. reactive compound (A) other than component A, comprising a compound (a) having at least one dicyclopentenyl group and/or isobornyl group (e.g., dicyclopentenyl acrylate) and, optionally, at most 3pts.wt., per pt.wt. component (a), other reactive compounds (b) (e.g., phenyl diethylene glycol methacrylate) and 0.05-15pts.wt. photopolymerization initiator (C) (e.g., hydroxyisobutyrophenone) which can form radicals by irradiation with light.
JP17632487A 1987-07-15 1987-07-15 Photocurable resin composition Pending JPS6420216A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17632487A JPS6420216A (en) 1987-07-15 1987-07-15 Photocurable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17632487A JPS6420216A (en) 1987-07-15 1987-07-15 Photocurable resin composition

Publications (1)

Publication Number Publication Date
JPS6420216A true JPS6420216A (en) 1989-01-24

Family

ID=16011594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17632487A Pending JPS6420216A (en) 1987-07-15 1987-07-15 Photocurable resin composition

Country Status (1)

Country Link
JP (1) JPS6420216A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02298507A (en) * 1989-05-15 1990-12-10 Nippon Kayaku Co Ltd Resin composition
JPH09236809A (en) * 1995-12-27 1997-09-09 Mitsui Toatsu Chem Inc Resin composition to seal liquid crystal
WO1999058606A1 (en) * 1998-05-13 1999-11-18 Universite De Liege Method for reinforcing thermosetting resins with isobornyl acrylate or methacrylate polymers
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
JP2007268663A (en) * 2006-03-31 2007-10-18 Nachi Fujikoshi Corp Synchro sleeve inner diameter broaching tool
JP2018178040A (en) * 2017-04-20 2018-11-15 アイカ工業株式会社 Photocurable resin composition
CN111072871A (en) * 2019-12-24 2020-04-28 无锡市腰果新材料有限公司 High-temperature-resistant SLA (SLA-like three-dimensional) 3D printing photocuring material and preparation method thereof
WO2024075480A1 (en) * 2022-10-04 2024-04-11 三菱瓦斯化学株式会社 Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02298507A (en) * 1989-05-15 1990-12-10 Nippon Kayaku Co Ltd Resin composition
JPH09236809A (en) * 1995-12-27 1997-09-09 Mitsui Toatsu Chem Inc Resin composition to seal liquid crystal
WO1999058606A1 (en) * 1998-05-13 1999-11-18 Universite De Liege Method for reinforcing thermosetting resins with isobornyl acrylate or methacrylate polymers
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
JP2007268663A (en) * 2006-03-31 2007-10-18 Nachi Fujikoshi Corp Synchro sleeve inner diameter broaching tool
JP2018178040A (en) * 2017-04-20 2018-11-15 アイカ工業株式会社 Photocurable resin composition
CN111072871A (en) * 2019-12-24 2020-04-28 无锡市腰果新材料有限公司 High-temperature-resistant SLA (SLA-like three-dimensional) 3D printing photocuring material and preparation method thereof
WO2024075480A1 (en) * 2022-10-04 2024-04-11 三菱瓦斯化学株式会社 Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container

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