JPS6420215A - Photocurable resin composition - Google Patents

Photocurable resin composition

Info

Publication number
JPS6420215A
JPS6420215A JP17632587A JP17632587A JPS6420215A JP S6420215 A JPS6420215 A JP S6420215A JP 17632587 A JP17632587 A JP 17632587A JP 17632587 A JP17632587 A JP 17632587A JP S6420215 A JPS6420215 A JP S6420215A
Authority
JP
Japan
Prior art keywords
photopolymerization initiator
component
compound
polybutadiene resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17632587A
Other languages
Japanese (ja)
Inventor
Hiroshi Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17632587A priority Critical patent/JPS6420215A/en
Publication of JPS6420215A publication Critical patent/JPS6420215A/en
Pending legal-status Critical Current

Links

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the title composition excellent in adhesion to metals, ceramics, etc., and heat cycle resistance, and low in modulus, by mixing a photocurable polybutadiene resin with a specified reactive compound and a photopolymerization initiator. CONSTITUTION:100pts.wt. photocurable polybutadiene resin (A) having an MW of 500-5,000 and photo/radical-polymerizable functional groups on molecular ends is mixed with 20-230pts.wt. reactive compound (B) other than component (A) comprising a compound (a) having at least one dicyclopentenyl group and/or isobornyl group (e.g., dicyclopentenyl acrylate) and, optionally, at most 3pts.wt., per pt.wt. component (a), other reactive compounds (b) (e.g., phenyl diethylene glycol) and 0.05-15pts.wt. photopolymerization initiator (C) (e.g., hydroxyisobutyrophenone) which can form radicals upon irradiation with light.
JP17632587A 1987-07-15 1987-07-15 Photocurable resin composition Pending JPS6420215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17632587A JPS6420215A (en) 1987-07-15 1987-07-15 Photocurable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17632587A JPS6420215A (en) 1987-07-15 1987-07-15 Photocurable resin composition

Publications (1)

Publication Number Publication Date
JPS6420215A true JPS6420215A (en) 1989-01-24

Family

ID=16011611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17632587A Pending JPS6420215A (en) 1987-07-15 1987-07-15 Photocurable resin composition

Country Status (1)

Country Link
JP (1) JPS6420215A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6485209A (en) * 1987-09-25 1989-03-30 Kemitetsuku Kk Ultraviolet ray curable adhesive composition
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
JP2007308681A (en) * 2006-04-18 2007-11-29 Hitachi Chem Co Ltd Photo-curable resin composition, photo- curable moisture-preventing insulation coating for mounting circuit board, electronic part and method for producing the same
CN114907737A (en) * 2022-06-02 2022-08-16 广东希贵光固化材料有限公司 EB (Electron Beam) adhesion primer for outer wall calcium silicate board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6485209A (en) * 1987-09-25 1989-03-30 Kemitetsuku Kk Ultraviolet ray curable adhesive composition
US6048587A (en) * 1998-10-01 2000-04-11 Ricon Resins, Inc. Water-dispersible, radiation and thermally-curable polymeric compositions
JP2007308681A (en) * 2006-04-18 2007-11-29 Hitachi Chem Co Ltd Photo-curable resin composition, photo- curable moisture-preventing insulation coating for mounting circuit board, electronic part and method for producing the same
CN114907737A (en) * 2022-06-02 2022-08-16 广东希贵光固化材料有限公司 EB (Electron Beam) adhesion primer for outer wall calcium silicate board

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