JPS6418778U - - Google Patents
Info
- Publication number
- JPS6418778U JPS6418778U JP1987113376U JP11337687U JPS6418778U JP S6418778 U JPS6418778 U JP S6418778U JP 1987113376 U JP1987113376 U JP 1987113376U JP 11337687 U JP11337687 U JP 11337687U JP S6418778 U JPS6418778 U JP S6418778U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film substrate
- integrated circuit
- hybrid integrated
- location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113376U JPS6418778U (de) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113376U JPS6418778U (de) | 1987-07-23 | 1987-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418778U true JPS6418778U (de) | 1989-01-30 |
Family
ID=31353157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987113376U Pending JPS6418778U (de) | 1987-07-23 | 1987-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418778U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09191061A (ja) * | 1996-01-09 | 1997-07-22 | Nec Corp | チップキャリア |
-
1987
- 1987-07-23 JP JP1987113376U patent/JPS6418778U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09191061A (ja) * | 1996-01-09 | 1997-07-22 | Nec Corp | チップキャリア |