JPS6418734U - - Google Patents

Info

Publication number
JPS6418734U
JPS6418734U JP11280587U JP11280587U JPS6418734U JP S6418734 U JPS6418734 U JP S6418734U JP 11280587 U JP11280587 U JP 11280587U JP 11280587 U JP11280587 U JP 11280587U JP S6418734 U JPS6418734 U JP S6418734U
Authority
JP
Japan
Prior art keywords
semiconductor device
chip
die island
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11280587U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11280587U priority Critical patent/JPS6418734U/ja
Publication of JPS6418734U publication Critical patent/JPS6418734U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11280587U 1987-07-23 1987-07-23 Pending JPS6418734U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11280587U JPS6418734U (cs) 1987-07-23 1987-07-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11280587U JPS6418734U (cs) 1987-07-23 1987-07-23

Publications (1)

Publication Number Publication Date
JPS6418734U true JPS6418734U (cs) 1989-01-30

Family

ID=31352078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11280587U Pending JPS6418734U (cs) 1987-07-23 1987-07-23

Country Status (1)

Country Link
JP (1) JPS6418734U (cs)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814557A (ja) * 1981-07-17 1983-01-27 Fujitsu Ltd 半導体装置
JPS59134857A (ja) * 1983-01-21 1984-08-02 Toshiba Corp 半導体装置
JPS59159552A (ja) * 1983-03-03 1984-09-10 Yamagata Nippon Denki Kk 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814557A (ja) * 1981-07-17 1983-01-27 Fujitsu Ltd 半導体装置
JPS59134857A (ja) * 1983-01-21 1984-08-02 Toshiba Corp 半導体装置
JPS59159552A (ja) * 1983-03-03 1984-09-10 Yamagata Nippon Denki Kk 半導体装置

Similar Documents

Publication Publication Date Title
JPS63178342U (cs)
JPS6418734U (cs)
JPH0276620U (cs)
JPH0222238U (cs)
JPH02735U (cs)
JPH0317640U (cs)
JPS62188149U (cs)
JPH0371655U (cs)
JPH0272558U (cs)
JPS6387843U (cs)
JPS6437054U (cs)
JPH0276694U (cs)
JPH0316346U (cs)
JPH0295238U (cs)
JPH0442742U (cs)
JPH0325252U (cs)
JPS62163966U (cs)
JPH0195749U (cs)
JPH044767U (cs)
JPH0221728U (cs)
JPS6373950U (cs)
JPS6364051U (cs)
JPS6337211U (cs)
JPS62193736U (cs)
JPS6373949U (cs)