JPS6418211A - Chip electronic component - Google Patents

Chip electronic component

Info

Publication number
JPS6418211A
JPS6418211A JP17509987A JP17509987A JPS6418211A JP S6418211 A JPS6418211 A JP S6418211A JP 17509987 A JP17509987 A JP 17509987A JP 17509987 A JP17509987 A JP 17509987A JP S6418211 A JPS6418211 A JP S6418211A
Authority
JP
Japan
Prior art keywords
electronic component
sheet
electronic components
conductive
sized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17509987A
Other languages
Japanese (ja)
Inventor
Harufumi Bandai
Yukio Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP17509987A priority Critical patent/JPS6418211A/en
Publication of JPS6418211A publication Critical patent/JPS6418211A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To eliminate the difficulty of an assembly operation even when an electronic component itself becomes small-sized by a method wherein the electronic component itself is mounted on a sheet and it is assembled by connecting a terminal electrode to a conductive film. CONSTITUTION:After a number of conductive patterns 14,... to be used as conductive films 4, 4,... have been formed on a highly heatresisting sheet 3 (13), a solder paste is coated on the individual conductive patterns 14 by a screen printing method. Components themselves 1,... are mounted on the coated surface as shown in Fig. (b) ; terminal electrodes 2, 2 are connected to the conductive films 4, 4 by a reflow method; after that, the electronic components are obtained it the sheet 13 is cut. By this setup, the electronic components can be assembled easily even when they become small-sized; the required number of electronic components can be reduced.
JP17509987A 1987-07-14 1987-07-14 Chip electronic component Pending JPS6418211A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17509987A JPS6418211A (en) 1987-07-14 1987-07-14 Chip electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17509987A JPS6418211A (en) 1987-07-14 1987-07-14 Chip electronic component

Publications (1)

Publication Number Publication Date
JPS6418211A true JPS6418211A (en) 1989-01-23

Family

ID=15990238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17509987A Pending JPS6418211A (en) 1987-07-14 1987-07-14 Chip electronic component

Country Status (1)

Country Link
JP (1) JPS6418211A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012522382A (en) * 2009-03-26 2012-09-20 ケメット エレクトロニクス コーポレーション Leaded multilayer ceramic capacitor with low ESL and ESR

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681919A (en) * 1979-12-07 1981-07-04 Matsushita Electric Ind Co Ltd Electric part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681919A (en) * 1979-12-07 1981-07-04 Matsushita Electric Ind Co Ltd Electric part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012522382A (en) * 2009-03-26 2012-09-20 ケメット エレクトロニクス コーポレーション Leaded multilayer ceramic capacitor with low ESL and ESR

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